Shift register, semiconductor device, display device, and electronic device

ABSTRACT

The invention provides a semiconductor device and a shift register, in which low noise is caused in a non-selection period and a transistor is not always on. First to fourth transistors are provided. One of a source and a drain of the first transistor is connected to a first wire, the other of the source and the drain thereof is connected to a gate electrode of the second transistor, and a gate electrode thereof is connected to a fifth wire. One of a source and a drain of the second transistor is connected to a third wire and the other of the source and the drain thereof is connected to a sixth wire. One of a source and a drain of the third transistor is connected to a second wire, the other of the source and the drain thereof is connected to the gate electrode of the second transistor, and a gate electrode thereof is connected to a fourth wire. One of a source and a drain of the fourth transistor is connected to the second wire, the other of the source and the drain thereof is connected to the sixth wire, and a gate electrode thereof is connected to the fourth wire.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/584,117, filed May 2, 2017, now allowed, which is a continuation ofU.S. application Ser. No. 14/800,765, filed Jul. 16, 2015, now U.S. Pat.No. 9,646,714, which is a continuation of U.S. application Ser. No.11/539,429, filed Oct. 6, 2006, now U.S. Pat. No. 9,153,341, whichclaims the benefit of foreign a priority application filed in Japan asSerial No. 2005-303771 on Oct. 18, 2005, all of which are incorporatedby reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The invention relates to a semiconductor device. In particular, theinvention relates to a shift register constituted using a transistor.Further, the invention relates to a display device provided with thesemiconductor device, and to an electronic device provided with thedisplay device.

It is to be noted that the semiconductor device here refers to a generaldevice which can function by utilizing semiconductor characteristics.

2. Description of the Related Art

In recent years, a display device such as a liquid crystal displaydevice and a light emitting device is actively developed in accordancewith the increase of large display devices such as a liquid crystaldisplay. In particular, a technique to integrate a driver circuit(hereinafter referred to as an internal circuit) including a pixelcircuit, a shift register circuit, and the like over an insulator byusing transistors formed of an amorphous semiconductor is activelydeveloped, which largely contributes to the reduction in powerconsumption and cost. The internal circuit formed over the insulator isconnected to a controller IC or the like (hereinafter referred to as anexternal circuit) through an FPC or the like and controlled in itsoperation.

For example, a shift register circuit which is constituted using onlyn-channel transistors formed of an amorphous semiconductor is suggested(for example, see Patent Document 1). However, the circuit disclosed inPatent Document 1 has a problem in that a noise is generated in anon-selection period since an output of the shift register circuitbecomes a floating state in the non-selection period.

In order to solve this problem, a shift register circuit in which anoutput thereof does not become a floating state in a non-selectionperiod is suggested (for example, see Non-Patent Document 1).

Patent Document 1

-   Japanese Translation of PCT International Application No. Hei    10-500243

Non-Patent Document 1

-   2.0 inch a-Si:H TFT-LCD with Low Noise Integrated Gate Driver SID'05    Digest p. 942-945

SUMMARY OF THE INVENTION

In Non-Patent Document 1, a power source voltage is outputted by alwaysturning on a transistor which is connected in series between an outputand a power source in a non-selection period. Further, since as most ofan operation period of the shift register circuit corresponds to thenon-selection period, the transistor which is always on in thenon-selection period is on in most of the operation period of the shiftregister circuit.

However, it is known that a transistor formed of an amorphoussemiconductor deteriorates in characteristics in accordance with anapplied voltage and time it is on. In particular, a shift in a thresholdvoltage is notable, in which a threshold voltage rises. It is one of themajor causes of malfunction of the shift register circuit.

In view of such a problem, the invention provides a semiconductor deviceand a shift register circuit in which a noise is low in thenon-selection period and a transistor is not always turned on, andprovides a display device provided with such a semiconductor device andan electronic device provided with the display device.

A semiconductor device of the invention includes a first transistor, asecond transistor, a third transistor, and a fourth transistor. A firstsignal is inputted to a gate of the first transistor, a predeterminedpotential is inputted to one of a source and a drain thereof, and theother of the source and the drain is connected to a gate of a secondtransistor and one of a source and a drain of a third transistor. Asecond signal is inputted to one of a source and a drain of the secondtransistor, the other of the source and the drain is connected to anoutput terminal. A third signal is inputted to a gate of the thirdtransistor and a predetermined potential is inputted to the other of thesource and the drain thereof. A third signal is inputted to a gate ofthe fourth transistor, a predetermined potential is inputted to one of asource and a drain thereof, and the other of the source and the drain isconnected to an output terminal.

A shift register of the invention is a shift register constituted by aplurality of stages. Each stage of the shift register includes a firsttransistor which is turned on when an H-level output signal is inputtedfrom a preceding stage and outputs a potential as high as the H-level, asecond transistor which is turned on by an output of the firsttransistor and in which one of a source and a drain is connected to afirst signal line and the other of the source and the drain is connectedto the first transistor of a next stage, a first unit for outputting anL-level potential to a gate of the second transistor at regularintervals in a period when an L-level output signal is inputted from apreceding stage and the second transistor is not in a boot strapoperation, and a second unit for outputting an L-level potential to theother of the source and the drain of the second transistor at regularintervals in a period when an L-level output signal is inputted from apreceding stage and the second transistor is not in a boot strapoperation.

In a shift register of the invention with the aforementionedconfiguration, the first unit and the second unit are controlled by asecond signal line.

In a shift register of the invention with the aforementionedconfiguration, the first unit includes a third transistor having afunction to output an L-level potential when a second signal line is atH-level and output no potential when the second signal line is atL-level.

In a shift register of the invention with the aforementionedconfiguration, the second unit includes a fourth transistor having afunction to output an L-level potential when the second signal line isat H-level and output nothing when the second signal line is at L-level.

In a shift register of the invention with the aforementionedconfiguration, the first unit is controlled by an output signal from anext stage and the second unit is controlled by the second signal line.

In a shift register of the invention with the aforementionedconfiguration, the first unit includes a fifth transistor having afunction to output an L-level potential when a next stage outputs anH-level potential and output nothing when the next stage outputs anL-level potential.

In a shift register of the invention with the aforementionedconfiguration, the second unit includes a sixth transistor having afunction to output an L-level potential when the second signal line isat H-level and output nothing when the second signal is at L-level.

In a shift register of the invention with the aforementionedconfiguration, the first unit is controlled by the second signal lineand the second unit is controlled by the second signal line and a thirdsignal line.

In a shift register of the invention with the aforementionedconfiguration, the first unit includes a seventh transistor having afunction to output an L-level potential when a next stage outputs anH-level potential and output nothing when the next stage outputs anL-level potential.

In a shift register of the invention with the aforementionedconfiguration, the second unit includes a shift register including aneighth transistor having a function to output an L-level potential whenthe second signal line is at H-level and output nothing when the secondsignal line is at L-level, and a shift register including a ninthtransistor having a function to output an L-level potential when thethird signal line is at H-level and output nothing when the third signalline is at L-level.

A shift register of the invention is a shift register constituted by aplurality of stages. Each stage of the shift register circuit includes afirst transistor which is turned on when an H-level output signal isinputted from a preceding stage and outputs a potential as high as theH-level, a second transistor which is turned on by an output of thefirst transistor and in which one of a source and a drain is connectedto a first signal line and the other of the source and the drain isconnected to the first transistor of a next stage, a first unit foroutputting an L-level potential to a gate of the second transistor atregular intervals in a period when an L-level output signal is inputtedfrom a preceding stage and the second transistor is not in a boot strapoperation, and a third unit for outputting an L-level potential to theother of the source and the drain of the second transistor in a periodwhen the second transistor is not in a boot strap operation.

In a shift register of the invention with the aforementionedconfiguration, the first unit is controlled by the second signal lineand the third unit is controlled by a first signal, a second signal, athird signal, and an inverted signal of a gate potential of the secondtransistor.

In a shift register of the invention with the aforementionedconfiguration, the first unit includes a tenth transistor having afunction to output an L-level potential when the second signal line isat H-level and output nothing when the second signal line is at L-level.

In a shift register of the invention with the aforementionedconfiguration, the second unit includes an eleventh transistor having afunction to output an L-level potential when the second signal line isat H-level and output nothing when the second signal line is at L-level,a twelfth transistor having a function to output an L-level potentialwhen the third signal line is at H-level and output nothing when thesecond signal line is at L-level, a thirteenth transistor having afunction to output a signal of the first signal line when the invertedsignal of the gate potential of the second transistor is at H-level andoutput nothing when the inverted signal of the gate potential of thesecond transistor is at L-level, and a fourteenth transistor having afunction to output an L-level potential when the thirteenth transistoroutputs a signal of the first signal line and the first signal line isat H-level, and output nothing when the first signal line is at L-leveland the thirteenth transistor outputs nothing.

A shift register of the invention with the aforementioned configurationincludes a fifteenth transistor having a function to output an UL-levelpotential when the gate potential of the second transistor is at H-leveland output nothing when the gate potential of the second transistor isat L-level, and an element with a resistive component, having oneterminal connected to an H-level potential and the other terminalconnected to an output of the fourteenth transistor.

In a shift register of the invention with the aforementionedconfiguration, the element with a resistive component is a sixteenthtransistor which is diode-connected.

A shift register of the invention is a shift register constituted by aplurality of stages. Each stage of the shift register includes a firsttransistor which is turned on when an H-level output signal is inputtedfrom a preceding stage and outputs a potential as high as the H-level, asecond transistor which is turned on by the output of the firsttransistor, in which one of a source and a drain is connected to a firstsignal line and the other of the source and the drain is connected to afirst transistor of a next stage, a fourth unit which outputs an L-levelpotential to a gate of the second transistor in a period when an L-leveloutput signal is inputted from a preceding stage and the secondtransistor is not in a boot strap operation, and a third unit whichoutputs an L-level potential to the other of the source and the drain ofthe second transistor in a period when the second transistor is not in aboot strap operation.

In a shift register of the invention with the aforementionedconfiguration, the third unit and the fourth unit are controlled by thefirst signal line, the second signal line, the third signal line, and aninverted signal of a gate potential of the second transistor.

In a shift register of the invention with the aforementionedconfiguration, the second unit includes a seventeenth transistor havinga function to output an L-level potential when the second signal line isat H-level and output nothing when the second signal line is at L-level,an eighteenth transistor having a function to output a signal of thefirst signal line when an inverted signal of a gate potential of thesecond transistor is at H-level and output nothing when the invertedsignal of the gate potential of the second transistor is at L-level, anineteenth transistor having a function to output a signal of the thirdsignal line when the inverted signal of the gate potential of the secondtransistor is at H-level and output nothing when the inverted signal ofthe gate potential of the second transistor is at L-level, a twentiethtransistor having a function to output an L-level when the eighteenthtransistor outputs a signal of the first signal line and the firstsignal line is at H-level and output nothing when the first signal lineis at L-level and the eighteenth transistor outputs nothing, and atwenty-first transistor having a function to output an L-level potentialwhen the eighteenth transistor outputs a signal of the first signal lineand the first signal line is at H-level and output nothing when thefirst signal line is at L-level and the nineteenth transistor outputsnothing.

In a shift register of the invention with the aforementionedconfiguration, a capacitor is connected between the gate and the otherof the source and drain of the second transistor.

In a shift register of the invention with the aforementionedconfiguration, an output signal of a preceding stage is inputted to thegate of the first transistor, one of the source and the drain of thefirst transistor is connected to the power source line at H-level, andthe other of the source and the drain of the first transistor isconnected to the gate of the second transistor.

In a shift register of the invention with the aforementionedconfiguration, an output signal of a preceding stage is inputted to thegate of the first transistor, one of the source and drain of the firsttransistor is connected to a power supply line at H-level, and the otherof the source and the drain of the first transistor is connected to thegate of the second transistor.

In a shift register of the invention with the aforementionedconfiguration, an output signal of a preceding stage is inputted to thegate and one of the source and the drain of the first transistor, andthe other of the source and the drain of the first transistor isconnected to the gate of the second transistor.

In a shift register of the invention with the aforementionedconfiguration, a control signal transmitted through the first signalline to be inputted to an N-th stage (N is a natural number), a controlsignal transmitted through the first signal line to be inputted to an(N+1)th stage, and a control signal transmitted through the first signalline to be inputted to an (N+2)th stage have a phase difference of 1200.

In a shift register of the invention with the aforementionedconfiguration, a control signal transmitted through the second signalline to be inputted to the N-th stage (N is a natural number), a controlsignal transmitted through the second signal line to be inputted to the(N+1)th stage, and a control signal transmitted through the secondsignal line to be inputted to the (N+2)th stage have a phase differenceof 120°.

In a shift register of the invention with the aforementionedconfiguration, a control signal transmitted through the third signalline to be inputted to the N-the stage (N is a natural number), acontrol signal transmitted through the third signal line to be inputtedto the (N+1)th stage, and a control signal transmitted through the thirdsignal line to be inputted to the (N+2)th stage have a phase differenceof 120°.

In a shift register of the invention with the aforementionedconfiguration, each of the first to twenty-first transistors is formedof an amorphous semiconductor.

In a shift register of the invention with the aforementionedconfiguration, at least one power source line is provided between thefirst, second, and third signal lines, and the first to twenty-firsttransistors.

In a shift register of the invention with the aforementionedconfiguration, a channel region of the second transistor has a U-shape.

In a shift register of the invention with the aforementionedconfiguration, an output signal of the shift register is outputtedthrough a level shifter circuit.

In a shift register of the invention with the aforementionedconfiguration, a control signal inputted to the shift register isinputted through a level shifter circuit.

In a shift register of the invention with the aforementionedconfiguration, a plurality of switching elements are sequentially turnedon by an output signal of the shift register.

In a display device of the invention with the aforementionedconfiguration, a pixel, a gate driver constituted by using a shiftregister, a gate signal line which transmits an output signal of thegate driver to the pixel, and a source signal line which transmits avideo signal to the pixel are provided. An output signal of the gatedriver selects the pixel, thereby the video signal is written to theselected pixel.

Further, the pixel includes at least a liquid crystal element of whichtransmittance changes depending on an applied voltage and atwenty-second transistor which operates as a switching element which iscontrolled to be turned on or off by a gate signal line. A video signalis written to the liquid crystal element through the twenty-secondtransistor which is turned on.

In a display device of the invention, a gate driver is constituted by atransistor formed of an amorphous semiconductor. The gate drivers arearranged to be opposed to each other and select the same gate signalline at the same timing.

In the invention, in a non-selection period, by sequentially turning ona plurality of transistors which output a power source voltage, there isno transistor which is always on. Therefore, characteristicsdeterioration of the transistor can be suppressed. Further, a noise canbe reduced when a fixed voltage is outputted at all times or for acertain period in a non-selection period.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram showing Embodiment Mode 1.

FIG. 2 is a diagram showing Embodiment Mode 1.

FIG. 3 is a diagram showing Embodiment Mode 1.

FIGS. 4A and 4B are diagrams showing Embodiment Mode 1.

FIG. 5 is a diagram showing Embodiment Modes 2 to 4.

FIG. 6 is a diagram showing Embodiment Mode 2.

FIGS. 7A and 7B are diagrams showing Embodiment Mode 2.

FIG. 8 is a diagram showing Embodiment Mode 3.

FIGS. 9A and 9B are diagrams showing Embodiment Mode 3.

FIGS. 10A and 10B are diagrams showing Embodiment Mode 3.

FIG. 11 is a diagram showing Embodiment Mode 4.

FIG. 12 is a diagram showing Embodiment Mode 4.

FIG. 13 is a diagram showing Embodiment Mode 5.

FIG. 14 is a diagram showing Embodiment Mode 5.

FIG. 15 is a diagram showing Embodiment Modes 5 and 6.

FIG. 16 is a diagram showing Embodiment Modes 5 and 6.

FIG. 17 is a diagram showing Embodiment Mode 5.

FIG. 18 is a diagram showing Embodiment Mode 5.

FIG. 19 is a diagram showing Embodiment Mode 5.

FIG. 20 is a diagram showing Embodiment Mode 5.

FIG. 21 is a diagram showing Embodiment Mode 6.

FIG. 22 is a diagram showing Embodiment Mode 6.

FIG. 23 is a diagram showing Embodiment Mode 6.

FIGS. 24A and 24B are diagrams showing Embodiment 1.

FIGS. 25A to 25C are diagrams showing Embodiment 6.

FIG. 26 is a diagram showing Embodiment 7.

FIGS. 27A to 27D are diagrams showing Embodiment 8.

FIGS. 28A and 28B are views showing Embodiment 2.

FIGS. 29A and 29B are views showing Embodiment 2.

FIGS. 30A and 30B are views showing Embodiment 2.

FIGS. 31A to 31C are diagrams showing Embodiment 3.

FIGS. 32A to 32D are diagrams showing Embodiment 3.

FIGS. 33A to 33C are diagrams showing Embodiment 3.

FIGS. 34A to 34D are diagrams showing Embodiment 3.

FIGS. 35A to 35D are diagrams showing Embodiment 3.

FIGS. 36A to 36D are diagrams showing Embodiment 3.

FIGS. 37A and 37B are diagrams showing Embodiment 3.

FIG. 38 is a diagram showing Embodiment Mode 6.

FIG. 39 is a diagram showing Embodiment Mode 6.

FIG. 40 is a diagram showing Embodiment Mode 6.

FIGS. 41A and 41B are diagrams showing Embodiment 5.

FIGS. 42A and 42B are diagrams showing Embodiment 5.

FIGS. 43A and 43B are diagrams showing Embodiment 5.

FIG. 44 is a diagram showing Embodiment Mode 7.

FIG. 45 is a diagram showing Embodiment Mode 7.

FIG. 46 is a diagram showing Embodiment Mode 6.

FIG. 47 is a diagram showing Embodiment Mode 6.

FIG. 48 is a diagram showing Embodiment Mode 3.

FIG. 49 is a diagram showing Embodiment Mode 6.

FIGS. 50A and 50B are diagrams showing Embodiment Mode 3.

FIG. 51 is a diagram showing Embodiment Mode 1.

FIG. 52 is a diagram showing Embodiment Mode 2.

FIG. 53 is a diagram showing Embodiment Mode 3.

FIG. 54 is a diagram showing Embodiment Mode 4.

FIG. 55 is a diagram showing Embodiment Mode 1.

FIG. 56 is a diagram showing Embodiment Mode 2.

FIG. 57 is a diagram showing Embodiment Mode 3.

FIG. 58 is a diagram showing Embodiment Mode 4.

FIGS. 59A and 59B are diagrams showing Embodiment Mode 1.

FIGS. 60A and 60B are diagrams showing Embodiment Mode 2.

FIGS. 61A and 61B are diagrams showing Embodiment Mode 3.

FIGS. 62A and 62B are diagrams showing Embodiment Modes 3 and 4.

FIG. 63 is a diagram showing Embodiment Mode 4.

DETAILED DESCRIPTION OF THE INVENTION

Although the present invention will be fully described by way ofembodiment modes and embodiments with reference to the accompanyingdrawings, it is to be understood that various changes and modificationswill be apparent to those skilled in the art. Therefore, unless suchchanges and modifications depart from the scope of the invention, theyshould be construed as being included therein.

Embodiment Mode 1

In this embodiment mode, description is made with reference to FIGS. 1to 4 of a configuration and an operation of a shift register circuit inwhich a noise is reduced by outputting VSS at regular intervals forreducing a noise of an output voltage in a non-selection period.

As shown in FIG. 1, a circuit 10 constitutes a shift register circuitwith n (n is a natural number of 2 or larger) circuits SR(1) to SR(n)connected in series.

An input terminal 11 is an input terminal for inputting a start pulse inSR(1) as the circuit 10 of a first stage and for inputting an outputfrom an output terminal 14 of a preceding stage in the circuits 10 ofsecond to n-th stages. An input terminal 12 is an input terminal forsequentially inputting CK1, CK2, and CK3 in such a manner that CK1 isinputted as a clock signal to SR(1) as the circuit 10 of the firststage, CK2 is inputted as a clock signal to SR(2) as the circuit 10 ofthe second stage, CK3 is inputted as a clock signal to SR(3) as thecircuit 10 of the third stage, and CK1 is inputted to SR(4) as thecircuit 10 of the fourth stage.

An input terminal 13 is an input terminal for sequentially inputtingCK1, CK2, and CK3 in such a manner that CK2 is inputted to SR(1) as thecircuit 10 of the first stage, CK3 is inputted to SR(2) as the circuit10 of the second stage, CK1 is inputted to SR(3) as the circuit 10 ofthe third stage, and CK2 is inputted to SR(4) as the circuit 10 of thefourth stage. The output terminal 14 is an output terminal of thecircuit 10, which outputs OUT(l) from SR(1) as the circuit 10 of thefirst stage and outputs OUT(1) to the input terminal 11 of SR(2) as thecircuit 10 of the second stage, outputs OUT(2) from SR(2) as the circuit10 of the second stage and outputs OUT(2) to the input terminal 11 ofSR(3) as the circuit 10 of the third stage. It is to be noted that theinput terminals 11 to 14 are connected to wires respectively.

Here, SSP, CK1, CK2, and CK3 are 1-bit signals each having a binaryvalue of High and Low. Moreover, OUT(1). OUT(2), OUT(3), OUT(n−1), andOUT(n) are 1-bit signals each having a binary value of High and Low.High is the same potential as VDD which is a positive power sourcewhereas Low is the same potential as VSS which is a negative powersource.

An operation of the shift register circuit shown in FIG. 1 is describedwith reference to a timing chart of this embodiment mode shown in FIG.2.

In FIG. 2, SSP is a start pulse which becomes High of which pulse widthbecomes one-third the cycle of CK1, CK2, and CK3. CK1, CK2, and CK3 arethree-phase clock signals. In FIG. 1, it is preferable that SSP becomeHigh when CK3 becomes High. A node P(1) has a potential of a node Pshown in FIG. 3 which is described later. OUT(I) is an output of SR(1)as the circuit 10 of the first stage, OUT(2) is an output of SR(2) asthe circuit 10 of the second stage, and OUT(3) is an output of SR(3) asthe circuit 10 of the third stage, OUT(n−1) is an output of SR(n−1) asthe circuit 10 of the (n−1)th stage, and OUT(n) is an output of SR(n) asthe circuit 10 of the n-th stage.

As shown in the timing chart of FIG. 2, when SSP becomes High in aperiod T1, OUT(1) becomes High in the period T2, and then OUT(2) becomesHigh in the period T3. In this manner, a shift register circuit isrealized by shifting an output of SSP.

Next, a configuration of the circuit 10 of the first stage is describedwith reference to FIG. 3.

The circuit 10 shown in FIG. 3 is configured with the input terminal 11,the input terminal 12, the input terminal 13, the output terminal 14, atransistor 31, a transistor 32, a capacitor 33, a circuit 34, and acircuit 35. It is to be noted that the input terminals 11 to 13 areconnected to wires. The input terminals 11 to 13 and the output terminal14 are similar to those described in FIG. 1. The transistors 31 and 32are n-channel transistors formed of an amorphous semiconductor, apolycrystal semiconductor, or a single crystal semiconductor. Thecapacitor 33 is a capacitor having two electrodes. The circuit 34 is acircuit which outputs Low to the node P when the CK2 is High and ofwhich output becomes a floating state when CK2 is Low. The circuit 35 isa circuit which outputs Low to the output terminal 14 when CK2 is Highand of which output becomes a floating state when CK2 is Low.

Connections in the circuit shown in FIG. 3 are described. A gate of thetransistor 31 is connected to the input terminal 11, one of a source anda drain thereof is connected to VDD, and the other of the source and thedrain is connected to one electrode of the capacitor 33, a gate of thetransistor 32 and an output terminal of the circuit 34, that is the nodeP. Further, one of the source and the drain of the transistor 32 isconnected to the input terminal 12 and the other of the source and thedrain thereof is connected to an output terminal of the circuit 35, theother terminal of the capacitor 33, and the output terminal 14. Theinput terminal 13 is connected to an input terminal of the circuit 34and an input terminal of the circuit 35.

Description is made of an operation of the circuit shown in FIG. 3 inthe period T1, the period T2, and the period T3 separately withreference to the timing chart of this embodiment mode shown in FIG. 2.Moreover, potentials of the node P and OUT(1) are VSS in an initialstate.

In the period T1, SSP becomes High, CK1 becomes Low, CK2 becomes Low,and CK3 becomes High. A gate potential of the transistor 31 at this timeis VDD, a potential of one of the source and the drain thereof is VDD,and that of the other of the source and the drain thereof is VSS.Therefore, the transistor 31 is turned on and the potential of the nodeP starts rising. The rise of the potential of the node P stops when itbecomes a potential lower than VDD by a threshold voltage of thetransistor 31, thereby the transistor 31 is turned off. A potential ofthe node P at this time is Vn1. Further, as CK2 is Low, the outputs ofthe circuits 34 and 35 are in floating states. Therefore, as a charge isnot supplied to the node P, the node P becomes a floating state. A gatepotential of the transistor 32 at this time is Vn1, a potential of oneof the source and the drain thereof is VSS, and the other of the sourceand the drain thereof is VSS, thus the transistor 32 is on. However, asthe potential of one of the source and the drain and the potential ofthe other thereof are the same, there is no move in charge, thereby nocurrent flows and no potential changes. The capacitor 33 holds apotential difference between VSS as the potential of the output terminal14 and Vn1 as the potential of the node P.

In the period T2, SSP becomes Low, CK1 becomes High, CK2 becomes Low,and CK3 becomes Low. The gate potential of the transistor 31 at thistime is VSS, that of one of the source and the drain thereof is VDD, andthat of the other of the source and the drain thereof is Vn1, therebythe transistor 31 is turned off. As CK2 is Low, the outputs of thecircuits 34 and 35 become floating states. The gate potential of thetransistor 32 at this time is Vn1, that of one of the source and thedrain thereof is VDD, and that of the other of the source and the drainthereof, that is a potential of the output terminal 14 becomes VSS,thereby the transistor 32 is turned on and the potential of the outputterminal 14 starts rising. Then, the capacitor 33 which is connectedbetween the gate and the other of the source and the drain of thetransistor 32 holds the potential difference held in the period T1 as itis; therefore, when a potential of the other of the source and the drainrises, a gate voltage rises at the same time. A potential of the node Pis Vn2 at this time. When the potential of the node P rises as high asthe sum of VDD and a threshold voltage of the transistor 32, the rise ofthe potential of the output terminal 14 stops at VDD which is the sameas CK1. In other words, by the boot strap operation, the potential ofthe output terminal 14 can be raised as high as VDD which is a Highpotential of CK1.

In the period T3, SSP is Low, CK1 is low, CK2 is High, and CK3 is Low.At this time, the potential of the node P becomes VSS as CK2 is High andVSS is outputted from the circuit 34, and the potential of OUT(1)becomes VSS as VSS is outputted from the circuit 35. The gate potentialof the transistor 31 at this time becomes VSS, that of one of the sourceand the drain becomes VDD, and that of the other of the source and thedrain thereof becomes VSS, thereby the transistor 31 is turned off. Thegate potential of the transistor 32 becomes VSS, that of one of thesource and the drain thereof becomes VSS, and that of the other of thesource and the drain becomes VSS, thereby the transistor 32 is turnedoff.

By the operations in the periods T1, T2, and T3 described above, OUT(1)is outputted in the period T2 when SSP is inputted in the period T1.That is, the shift register is configured by connecting n stages of thecircuits 10 each of which outputs SSP with a shift of one-third of thecycle of the clock signal.

In FIG. 3, SR(1) as the circuit 10 of the first stage is shown. SR(n) asthe circuit 10 of the n-th stage is described with reference to FIG. 51.In FIG. 51, the transistor 31, the transistor 32, the capacitor 33, thecircuit 34, the circuit 35, the input terminal 11, the input terminal12, the input terminal 13, and the output terminal 14 are similar tothose shown in FIG. 3. An input signal inputted from the input terminal11 is connected to the output terminal 14 of the circuit 10 of thepreceding stage.

It is to be noted that the gate of the transistor 31 and the other ofthe source and the drain of the transistor 32 may be connected to a wire(hereinafter referred to as a “power source line”) which functions as apower source line, for example, to a power source line such as thepositive power source VDD and the negative power source VSS, anotherpower source line, or a wire which functions as another signal line(hereinafter referred to as a “signal line”). Moreover, the other of thesource and the drain of the transistor 31 may be connected to anothersignal line, for example, to a signal line such as CK1, CK2, CK3, andSSP, another signal line, or another power source line.

The transistors used in the shift register circuit shown in FIG. 3 areall n-channel transistors, thus forming a unipolar circuit, however,only p-channel transistors may be used as well. It is needless to saythat a p-channel transistor and an n-channel transistor may be used incombination. A shift register circuit where all the transistors arep-channel transistors is described with reference to FIG. 55.

In a circuit configuration shown in FIG. 55, the positive power sourceVDD, the negative power source VSS, the input terminal 11, the inputterminal 12, the input terminal 13, and the output terminal 14 can besimilar to those in FIG. 3. Transistors 551 and 552 are p-channeltransistors formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor. A capacitor 553 hastwo electrodes. A circuit 554 outputs High to the node P when CK2 is Lowand of which output becomes a floating state when CK2 is High. A circuit555 outputs High to the output terminal 14 when CK2 is Low and of whichoutput becomes a floating state when CK2 is High.

Connections in the circuit shown in FIG. 55 are described. A gate of thetransistor 551 is connected to the input terminal 11, one of a sourceand a drain thereof is connected to the positive power source VSS, theother of the source and the drain thereof is connected to one electrodeof the capacitor 553, a gate of the transistor 552 and an outputterminal of the circuit 554, that is the node P. One of a source and adrain of the transistor 552 is connected to the input terminal 12, theother of the source and the drain thereof is connected to an outputterminal of the circuit 555, the other electrode of the capacitor 553,and the output terminal 14. The input terminal 13 is connected to aninput terminal of the circuit 554 and an input terminal of the circuit555.

The gate of the transistor 551 and the other of the source and the drainof the transistor 552 may be connected to the power source line, forexample, to a power source line such as the positive power source VDDand the negative power source VSS, another power source line, or anothersignal line. Further, the other of the source and the drain of thetransistor 551 may be connected to a signal line, for example, to asignal line such as CK1, CK2, CK3, and SSP, another signal line, oranother power source line.

A configuration example of the circuit 554 shown in FIG. 55 is describedwith reference to FIG. 59A. As shown in the circuit 554 of FIG. 59A, theinput terminal 13 and the node P are similar to those in FIG. 55. Thetransistor 591 is a p-channel transistor formed of an amorphoussemiconductor, a polycrystal semiconductor, or a single crystalsemiconductor.

Connections in the circuit shown in FIG. 59A are described. A gate of atransistor 591 is connected to the input terminal 13, one of a sourceand a drain thereof is connected to VDD, and the other of the source andthe drain thereof is connected to the node P.

An operation of FIG. 59A is described. The transistor 591 is turned onwhen CK2 inputted from the input terminal 13 is Low, thereby VDD isoutputted to the node P, whereas the transistor 591 is turned off whenCK2 is High, thereby nothing is outputted to the node P. In this manner,the circuit 554 has a function to output High when CK2 is Low and ofwhich output becomes a floating state when CK2 is High. Further, anothercircuit configuration having the same function may be employed insteadof the aforementioned circuit configuration.

It is to be noted that one of the source and the drain of the transistor591 may be connected to a signal line, for example, to a signal linesuch as CK1, CK2, CK3, and SSP, another signal line, or another powersource line. Further, a gate of the transistor 591 may be connected to apower source line, for example, to a power source line such as thepositive power source VDD and the negative power source VSS, anotherpower source line, or another signal line.

A configuration example of the circuit 555 shown in FIG. 55 is describedwith reference to FIG. 59B. As shown in the circuit 555 of FIG. 59B, theinput terminal 13 and the output terminal 14 are similar to those inFIG. 55. A transistor 592 is a p-channel transistor formed of anamorphous semiconductor, a polycrystal semiconductor, or a singlecrystal semiconductor.

An operation of the circuit shown in FIG. 59B is described. Thetransistor 592 is turned on when CK2 inputted from the input terminal 13is Low, thereby VDD is outputted to the output terminal 14, whereas thetransistor 592 is turned off when CK2 is High, thereby nothing isoutputted to the output terminal 14. In this manner, the circuit 555 hasa function to output High when CK2 is Low and of which output becomes afloating state when CK2 is High. Further, another circuit configurationhaving the same function may be employed instead of the aforementionedcircuit configuration.

It is to be noted that one of the source and the drain of the transistor592 may be connected to a signal line, for example, to a signal linesuch as CK1, CK2, CK3, and SSP, another signal line, or another powersource line. Further, a gate of the transistor 592 may be connected to apower source line, for example, to a power source line such as thepositive power source VDD and the negative power source VSS, anotherpower source line, or another signal line.

Next, a configuration example of the circuit 34 shown in FIG. 3 isdescribed with reference to FIG. 4A.

In the circuit 34 shown in FIG. 4A, the input terminal 13 and the node Pare similar to those in FIG. 3. A transistor 41 is an n-channeltransistor formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor.

Connections of the circuit shown in FIG. 4A are described. A gate of thetransistor 41 is connected to the input terminal 13, one of a source anda drain thereof is connected to VSS, and the other of the source and thedrain thereof is connected to the node P.

An operation of the circuit shown in FIG. 4A is described. Thetransistor 41 is turned on when CK2 inputted from the input terminal 13is High, thereby VSS is outputted to the node P, whereas the transistor41 is turned off when CK2 is Low, thereby nothing is outputted to thenode P. In this manner, the circuit 34 has a function to output Low whenCK2 is High and of which output becomes a floating state when CK2 isLow. Further, another circuit configuration having the same function maybe employed instead of the aforementioned circuit configuration.

It is to be noted that one of the source and the drain of the transistor41 may be connected to a signal line, for example, to a signal line suchas CK1, CK2, CK3, and SSP, another signal line, or another power sourceline. Further, a gate of the transistor 41 may be connected to a powersource line, for example, to a power source line such as the positivepower source VDD and the negative power source VSS, another power sourceline, or another signal line.

A configuration example of the circuit 35 shown in FIG. 3 is describedwith reference to FIG. 4B.

In the circuit 35 shown in FIG. 4B, the input terminal 13 and the outputterminal 14 are similar to those in FIG. 3. A transistor 42 is ann-channel transistor formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor.

An operation of the circuit shown in FIG. 4B is described. Thetransistor 42 is turned on when CK2 inputted from the input terminal 13is High, thereby VSS is outputted to the output terminal 14, whereas thetransistor 42 is turned off when CK2 is Low, thereby nothing isoutputted to the output terminal 14. In this manner, the circuit 35 hasa function to output Low when CK2 is High and of which output becomes afloating state when CK2 is Low. Further, another circuit configurationhaving the same function may be employed instead of the aforementionedcircuit configuration.

It is to be noted that one of the source and the drain of the transistor42 may be connected to a signal line, for example, to a signal line suchas CK1, CK2, CK3, and SSP, another signal line, or another power sourceline. It is needless to say that one of the source and the drain of thetransistor 42 may be connected to a wire having VSS, to which one of thesource and the drain of the transistor 41 is connected. Further, thegate of the transistor 42 may be connected to a power source line, forexample, to a power source line such as the positive power source VDDand the negative power source VSS, another power source line, or anothersignal line.

That is, in the configurations shown in FIGS. 3 and 4, a firsttransistor (the transistor 31), a second transistor (the transistor 32),a third transistor (the transistor 41), and a fourth transistor (thetransistor 42) are provided. One of a source and a drain of the firsttransistor is connected to a first wire (VDD), the other of the sourceand the drain is connected to a gate electrode of the second transistorand the other of a source and a drain of the third transistor, a gateelectrode of the first transistor is connected to a fifth wire (theinput terminal 11), one of a source and a drain of the second transistoris connected to a third wire (the input terminal 12), the other of thesource and the drain is connected to a sixth wire (the output terminal14), one of the source and the drain of the third transistor isconnected to a second wire (VSS), the other of the source and the drainthereof is connected to a gate electrode of the second transistor, agate electrode of the third transistor is connected to a fourth wire(the input terminal 13), one of a source and a drain of the fourthtransistor is connected to the second wire (VSS), the other of thesource and the drain of the fourth transistor is connected to a sixthwire (the output terminal 14), and a gate electrode thereof is connectedto the fourth wire (the input terminal 13). Further, one of the sourceand the drain of the first transistor may be connected to a fifth wire(the input terminal 11).

In the shift register circuit as described above, VSS can be supplied tothe node P and the output terminal 14 as CK2 becomes High. That is, byinputting VSS at regular intervals in a non-selection period, a noisecan be reduced. Moreover, as there is no transistor which is stationaryon, characteristics deterioration of the transistor can be suppressed.In addition, as at least four transistors can be used for operation, thenumber of elements in a whole shift register circuit can be reduced,which enables to form an internal circuit in a small area over aninsulating substrate.

Hereinafter described are some configuration examples and operationexamples of this embodiment mode, which are variable. The configurationexamples and the operation examples described below can be applied to“SUMMARY OF THE INVENTION”, embodiment modes, and embodiments.

As shown in FIG. 1, the clock signals of CK1, CK2, and CK3 are inputtedwhen the circuit 10 is in a non-selection period, however, a switchingelement or the like may be provided so that the clock signals are notinputted to the circuit 10 in a non-selection period. As a result, aload on a clock signal line can be reduced and power consumption can bereduced.

Further, in FIG. 1, the shift register circuit described above may bescanned reversely. For example, an output of the circuit 10 of the n-thstage may be inputted to the circuit 10 of the (n−1)th stage. Byrepeating this in all the stages, the reverse scanning can be realized.

As shown in FIG. 2, a pulse width of SSP, CK1, CK2, and CK3 is aone-third cycle, the pulse width may be a little shorter than theone-third cycle. As a result, a current which flows instantaneously,such as a through current can be suppressed and an operation with a highoperation margin and low power consumption can be performed. In acircuit configuration which performs a boot strap operation, there is anode in a floating state, which is advantageous in performing a normalboot strap operation.

In FIG. 2, in a period when SSP is High, CK3 is High with the same pulsewidth. However, the invention is not limited to this. For example, whena signal is transmitted from an external circuit to an internal circuit,delay time may vary between control signals depending on a buffercircuit, a level shifter circuit which changes signal amplitude, or thelike.

In FIG. 3, the capacitor 33 is connected for a boot strap operation.However, if there is gate-source capacitance between the gate and theother of the source and the drain of the transistor 32, or the like,which is large enough for the boot strap operation, the capacitor 33 isnot always required to be provided. Moreover, the capacitor 33 may beformed by any method. For example, the capacitor may be formed between asemiconductor layer and a gate wiring layer or between an amorphoussemiconductor layer and a wire. It is advantageous to form a capacitorbetween a semiconductor layer and a gate wiring layer since thecapacitor can be formed with a thin G1 film (gate insulating film)interposed therebetween regardless of a bottom gate transistor or a topgate transistor, which enables to obtain more capacitance with a smallerarea.

In FIG. 3, SSP is inputted to the gate of the transistor 31, however,the gate and one of the source and the drain thereof may be connected toeach other, to which SSP may be inputted. As a result, one power sourceline can be reduced as the positive power source VDD is not required.Therefore, an area for forming the shift register circuit can besmaller. Consequently, a display device with higher resolution and anarrower frame can be provided.

The circuits 34 and 35 shown in FIG. 3 may be any circuits in which VSSis outputted when CK2 is High and of which output becomes a floatingstate when CK2 is Low as described above. Moreover, an output of thecircuit 10 of a next stage may be inputted to the input terminal of thecircuit 34, an output of the circuit 10 of a following stage may beinputted to the input terminal of the circuit 35 similarly, or an outputof the circuit 10 of a following stage may be inputted to the inputterminals of the circuits 34 and 35. By using the output of the circuit10 of a following stage, the circuits 34 and 35 can be synchronized notonly with a control signal but with an actual output of the shiftregister circuit as well; therefore, there is an advantage in that apotential can be changed appropriately in accordance with an operationof the shift register circuit.

As shown in FIG. 3, a capacitor may be connected between the node P, andVSS or VDD. By connecting the capacitor, a potential of the node P canbe stabilized.

It is to be noted in FIG. 3 that the circuit 34 is not always required.That is, as VSS is outputted at regular intervals by the circuit 35, thetransistor 32 is to be turned off even when the node P has a noise. As aresult, the number of elements can be reduced. At that time, a capacitormay be connected between the node P, and VSS or VDD.

Embodiment Mode 2

In this embodiment mode, description is made with reference to FIGS. 2and 5 to 7 of a configuration and an operation of a shift registercircuit in which a noise in an output voltage in a non-selection periodis reduced by outputting VSS at regular intervals.

As shown in FIG. 5, a circuit 50 forms a shift register circuit by n (nis a natural number of two or larger) circuits SR(1) to SR(n) connectedin series.

An input terminal 51 is an input terminal for inputting a start pulse inSR(1) as the circuit 50 of a first stage and for inputting an outputfrom an output terminal 55 of a preceding stage in SR(2) as the circuits50 of second to n-th stages. An input terminal 52 is an input terminalfor sequentially inputting CK1, CK2, and CK3 in such a manner that CK1is inputted as a clock signal to SR(1) as the circuit 50 of the firststage, CK2 is inputted as a clock signal to SR(2) as the circuit 50 ofthe second stage, CK3 is inputted as a clock signal to SR(3) as thecircuit 50 of the third stage, and CK1 is inputted to SR(4) as thecircuit 50 of the fourth stage. An input terminal 53 is an inputterminal for sequentially inputting clock signals in such a manner thatCK2 is inputted to SR(1) as the circuit 50 of the first stage, CK3 isinputted to SR(2) as the circuit 50 of the second stage, CK1 is inputtedto SR(3) as the circuit 50 of the third stage, and CK2 is inputted toSR(4) as the circuit 50 of the fourth stage. An input terminal 54 is aninput terminal for sequentially inputting clock signals in such a mannerthat CK3 is inputted to SR(1) as the circuit 50 of the first stage, CK1is inputted to SR(2) as the circuit 50 of the second stage, CK2 isinputted to SR(3) as the circuit 50 of the third stage, and CK3 isinputted to SR(4) as the circuit 50 of the fourth stage. The outputterminal 55 is an output terminal of the circuit 50, which outputsOUT(1) from SR(1) as the circuit 50 of the first stage and outputsOUT(1) to the input terminal 51 of SR(2) as the circuit 50 of the secondstage, outputs OUT(2) from SR(2) as the circuit 50 of the second stageand outputs OUT(2) to the input terminal 51 of SR(3) as the circuit 50of the third stage.

Here, SSP, CK1, CK2, and CK3 are 1-bit signals each having a binaryvalue of High and Low. High is the same potential as VDD which is apositive power source whereas Low is the same potential as VSS which isa negative power source. Here, SSP, CK1, CK2, and CK3 are 1-bit signalseach having a binary value of High and Low. Moreover, OUT(1). OUT(2),OUT(3), OUT(n−1), and OUT(n) are 1-bit signals each having a binaryvalue. High is the same potential as VDD which is a positive powersource whereas Low is the same potential as VSS which is a negativepower source.

An operation of the shift register circuit shown in FIG. 5 is describedwith reference to the timing chart of this embodiment mode shown in FIG.2.

SSP, CK1, CK2, and CK3 can be similar to those in Embodiment Mode 1. Itis to be noted that a node P(1) is the same potential as a node P inFIG. 6 described later. OUT(1) is an output of SR(1) as the circuit 50of the first stage, OUT(2) is an output of SR(2) as the circuit 50 ofthe second stage, OUT(3) is an output of SR(3) as the circuit 50 of thethird stage, OUT(n−1) is an output of SR(n−1) as the circuit 50 of the(n−1)th stage, and OUT(n) is an output of SR(n) as the circuit 50 of then-th stage.

In the timing chart of FIG. 2, when SSP becomes High as shown in theperiod T1, OUT(1) becomes High as shown in the period T2 and OUT(2)becomes High as shown in the period T3. In this manner, a shift registercircuit is realized by shifting an output of SSP.

Next, a configuration of the circuit 50 of the first stage is describedwith reference to FIG. 6.

The circuit 50 shown in FIG. 6 is configured with the input terminal 51,the input terminal 52, the input terminal 53, the input terminal 54, theoutput terminal 55, the transistor 31, the transistor 32, the capacitor33, the circuit 34, and the circuit 35. The input terminal 51, the inputterminal 52, the input terminal 53, the input terminal 54, and theoutput terminal 55 are similar to those described in FIG. 5. Thetransistor 31 and the transistor 32 are similar to those shown in FIG.3. A circuit 61 has a function to output Low to the node P when CK2 isHigh and of which output becomes a floating state when CK2 is Low. Thecircuit 62 has a function to output Low to the output terminal 55 wheneither of CK2 or CK3 is High and of which output becomes a floatingstate when CK2 and CK3 are Low.

Connections of the circuit shown in FIG. 6 are described. The gate ofthe transistor 31 is connected to the input terminal 51, one of thesource and the drain thereof is connected to VDD, and the other of thesource and the drain thereof is connected to one electrode of thecapacitor 33, the gate of the transistor 32, and an output terminal ofthe circuit 61, that is to the node P. One of the source and the drainof the transistor 32 is connected to the input terminal 52 and the otherof the source and the drain thereof is connected to an output terminalof the circuit 62, the other electrode of the capacitor 33, and theoutput terminal 55. The input terminal 53 is connected to an inputterminal of the circuit 61 and an input terminal of the circuit 62. Theinput terminal 54 is connected to the input terminal of the circuit 62.

Description is made of an operation of the circuit shown in FIG. 6 inthe period T1, the period T2, and the period T3 separately withreference to the timing chart of this embodiment mode shown in FIG. 2.Moreover, potentials of the node P and OUT(1) are VSS in an initialstate.

In the period T1, SSP becomes High, CK1 becomes Low, CK2 becomes Low,and CK3 becomes High. A gate potential of the transistor 31 at this timeis VDD, that of one of the source and the drain thereof is VDD, and thatof the other of the source and the drain thereof is VSS. Therefore, thetransistor 31 is turned on and the potential of the node P starts risingfrom VSS. The rise of the potential of the node P stops when it becomesa potential lower than VDD by a threshold voltage of the transistor 31,thereby the transistor 31 is turned off. A potential of the node P atthis time is Vn1. Further, as CK2 is Low, the output of the circuit 61is in a floating state. Therefore, as a charge is not supplied to thenode P, the node P becomes a floating state. As CK2 is Low and CK3 isHigh, the circuit 62 outputs Low. A gate potential of the transistor 32at this time is Vn1, a potential of one of the source and the drainthereof is VSS, and the other of the source and the drain thereof isVSS, thus the transistor 32 is on. However, as the potential of one ofthe source and the drain and the potential of the other thereof are thesame, there is no move in charge, thereby no current flows and nopotential changes. The capacitor 33 holds a potential difference betweenVSS as the potential of the output terminal 55 and Vn1 as the potentialof the node P.

In the period T2, SSP becomes Low, CK1 becomes High, CK2 becomes Low,and CK3 becomes Low. The gate potential of the transistor 31 at thistime is VSS, that of one of the source and the drain thereof is VDD, andthat of the other of the source and the drain thereof is Vn1, therebythe transistor 31 is turned off. As CK2 is Low, the output of thecircuit 61 becomes a floating state. As CK2 is Low and CK3 is Low, theoutput of the circuit 62 becomes a floating state. The gate potential ofthe transistor 32 at this time is Vn1, that of one of the source and thedrain thereof is VDD, and that of the other of the source and the drainthereof, that is a potential of the output terminal 55 becomes VSS,thereby the transistor 32 is turned on and the potential of the outputterminal 55 starts rising. Then, the capacitor 33 which is connectedbetween the gate and the other of the source and the drain of thetransistor 32 holds the potential difference held in the period T1 as itis; therefore, when a potential of the other of the source and the drainrises, a gate voltage rises at the same time. A potential of the node Pis Vn2 at this time. When the potential of the node P rises as high asthe sum of VDD and a threshold voltage of the transistor 32, the rise ofthe potential of the output terminal 14 stops at VDD which is the sameas CK1. In other words, by the boot strap operation, the potential ofthe output terminal 55 can be raised as high as VDD which is a Highpotential of CK1.

In the period T3, SSP is Low, CK1 is Low, CK2 is High, and CK3 is Low.At this time, the potential of the node P becomes VSS as CK2 is High andVSS is outputted from the circuit 61, and the potential of OUT(1)becomes VSS as VSS is outputted from the circuit 62. The gate potentialof the transistor 31 at this time becomes VSS, that of one of the sourceand the drain becomes VDD, and that of the other of the source and thedrain thereof becomes VSS, thereby the transistor 31 is turned off. Thegate potential of the transistor 32 becomes VSS, that of one of thesource and the drain thereof becomes VSS, and that of the other of thesource and the drain becomes VSS, thereby the transistor 32 is turnedoff.

By the operations in the periods T1, T2, and T3 described above, OUT(1)is outputted in the period T2 when SSP is inputted in the period T1.That is, the shift register circuit is configured by connecting n stagesof the circuits 50 each of which outputs SSP with a shift of one-thirdof the cycle of the clock signal.

The description has been made of the circuit 50 of the first stage shownin FIG. 6, but now the circuit 50 of the n-th stage is described withreference to FIG. 52. In FIG. 52, the transistor 31, the transistor 32,the capacitor 33, the circuit 61, the circuit 62, the input terminal 51,the input terminal 52, the input terminal 53, the input terminal 54, andthe output terminal 55 are similar to those described in FIG. 6. Afeature of the circuit is that an input signal inputted from the inputterminal 51 is connected to the output terminal 55 of a circuit of apreceding stage.

It is to be noted that the gate of the transistor 31 and the other ofthe source and the drain of the transistor 32 may be connected to apower source line, for example, to a power source line such as apositive power source VDD and a negative power source VSS, another powersource line, or another signal line. Further, the other of the sourceand the drain of the transistor 31 may be connected to a signal line,for example, to a signal line such as CK1, CK2, CK3, and SSP, anothersignal line, or another power source line.

The transistors used in the shift register circuit shown in FIG. 6 areall n-channel transistors, thus forming a unipolar circuit, however,only p-channel transistors may be used as well. It is needless to saythat a p-channel transistor and an n-channel transistor may be used incombination. A shift register circuit where all the transistors arep-channel transistors is described with reference to FIG. 56.

In a circuit configuration shown in FIG. 56, the positive power sourceVDD, the negative power source VSS, the input terminal 51, the inputterminal 52, the input terminal 53, the input terminal 54, thetransistor 551, the transistor 552, and the capacitor 553 can be similarto those in FIG. 55. A circuit 561 has a function to output High to thenode P when CK2 is Low and of which output becomes a floating state whenCK2 is High. A circuit 562 has a function to output High to the node Pwhen either of CK2 or CK3 is Low and of which output becomes a floatingstate when CK2 and CK3 are High.

Connections in the circuit shown in FIG. 56 are described. The gate ofthe transistor 551 is connected to the input terminal 51, one of thesource and the drain thereof is connected to the positive power sourceVSS, and the other of the source and the drain thereof is connected toone electrode of the capacitor 553, the gate of the transistor 552, andan output terminal of the circuit 561, that is to the node P. One of thesource and the drain of the transistor 552 is connected to the inputterminal 52 and the other of the source and the drain thereof isconnected to an output terminal of the circuit 562, the other electrodeof the capacitor 553, and the output terminal 55. The input terminal 53is connected to an input terminal of the circuit 561 and a first inputterminal of the circuit 562. The input terminal 54 is connected to asecond input terminal of a first transistor in the circuit 562.

It is to be noted that the gate of the transistor 551 and the other ofthe source and the drain of the transistor 552 may be connected to apower source line, for example, to a power source line such as thepositive power source VDD and the negative power source VSS, anotherpower source line, or another signal line. Further, the other of thesource and the drain of the transistor 551 may be connected to a signalline, for example, to a signal line such as CK1, CK2, CK3, and SSP,another signal line, or another power source line.

Next, a configuration example of the circuit 561 shown in FIG. 56 isdescribed with reference to FIG. 60A.

The input terminal 53 and the node P in the circuit 561 shown in FIG.60A are similar to those in FIG. 55. The transistor 601 is a p-channeltransistor formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor.

Connections in the circuit shown in FIG. 60A are described. A gate ofthe transistor 601 is connected to the input terminal 53, one of asource and a drain thereof is connected to VDD, and the other of thesource and the drain thereof is connected to a node P.

An operation of the circuit shown in FIG. 60A is described. Thetransistor 601 is turned on when CK2 inputted from the input terminal 53is Low, thereby VDD is outputted to the node P, whereas the transistor601 is turned off when CK2 is High, thereby nothing is outputted to thenode P. In this manner, the circuit 561 has a function to output Highwhen CK2 is Low and of which output becomes a floating state when CK2 isHigh. Further, another circuit configuration having the same functionmay be employed instead of the aforementioned circuit configuration.

It is to be noted that one of the source and the drain of the transistor601 may be connected to a signal line, for example, to a signal linesuch as CK1, CK2, CK3, and SSP, another signal line, or another powersource line. Further, a gate of the transistor 601 may be connected to apower source line, for example, to a power source line such as thepositive power source VDD and the negative power source VSS, anotherpower source line, or another signal line.

A configuration example of the circuit 562 shown in FIG. 56 is describedwith reference to FIG. 60B.

In the circuit 562 shown in FIG. 60B, the input terminals 53 and 54 andthe output terminal 55 are similar to those in FIG. 55. Transistors 602and 603 are p-channel transistors formed of an amorphous semiconductor,a polycrystal semiconductor, or a single crystal semiconductor.

An operation of the circuit shown in FIG. 60B is described. Thetransistor 602 is turned on when CK2 inputted from the input terminal 53is Low, thereby VDD is outputted to the output terminal 55, whereas thetransistor 602 is turned off when CK2 is High, thereby nothing isoutputted to the output terminal 55. The transistor 603 is turned onwhen CK3 inputted from the input terminal 54 is Low, thereby VDD isoutputted to the output terminal 55, whereas nothing is outputted to theoutput terminal 55 when CK3 is High. In this manner, the circuit 562 hasa function to output High when CK2 and CK3 are Low, and of which outputbecomes a floating state when CK2 and CK3 are High. Further, anothercircuit configuration having the same function may be employed insteadof the aforementioned circuit configuration.

It is to be noted that one of the source and the drain of the transistor592 may be connected to a signal line, for example, to a signal linesuch as CK1, CK2, CK3, and SSP, another signal line, or another powersource line. Further, a gate of the transistor 592 may be connected to apower source line, for example, to a power source line such as thepositive power source VDD and the negative power source VSS, anotherpower source line, or another signal line.

Next, a configuration example of the circuit 61 shown in FIG. 6 isdescribed with reference to FIG. 7A.

As shown in the circuit 61 shown in FIG. 7A, the input terminal 53 andthe node P are similar to those in FIG. 6. A transistor 71 is ann-channel transistor formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor.

Connections of the circuit shown in FIG. 7A are described. A gate of thetransistor 71 is connected to the input terminal 53, one of a source anda drain thereof is connected to VSS, and the other of the source and thedrain is connected to a node P.

An operation of the circuit shown in FIG. 7A is described. Thetransistor 71 is turned on when CK2 inputted from the input terminal 53is High, thereby VSS is outputted to the node P, whereas the transistor71 is turned off when CK2 is Low, thereby nothing is outputted to thenode P. In this manner, the circuit 71 has a function to output Low whenCK2 is High and of which output becomes a floating state when CK2 isLow. Further, another circuit configuration having the same function maybe employed instead of the aforementioned circuit configuration.

One of the source and the drain of the transistor 71 may be connected toa signal line, for example, to a signal line such as CK1, CK2, CK3, andSSP, another signal line, or another power source line. The gate of thetransistor 71 may be connected to a power source line, for example, apower source line such as the positive power source VDD and the negativepower source VSS, another power source line, or another signal line.

A configuration example of the circuit 62 shown in FIG. 6 is describedwith reference to FIG. 7B.

As shown in the circuit 62 shown in FIG. 7B, the input terminal 53, theinput terminal 54, and OUT(1) are similar to those in FIG. 6.Transistors 72 and 73 are n-channel transistors formed of an amorphoussemiconductor, a polycrystal semiconductor, or a single crystalsemiconductor.

Connections of the circuit shown in FIG. 7B are described. A gate of thetransistor 72 is connected to the input terminal 53, one of a source anda drain thereof is connected to VSS, and the other of the source and thedrain thereof is connected to the output terminal 55. A gate of thetransistor 73 is connected to the input terminal 54, one of a source anda drain thereof is connected to VSS, and the other of the source and thedrain is connected to the output terminal 55. It is needless to say thatone of the source and the drain of the transistors 72 and 73 may beconnected to a wire having VSS, to which one of the source and the drainof the transistor 71 is connected.

An operation of the circuit shown in FIG. 7B is described. Thetransistor 72 is turned on when CK2 inputted from the input terminal 53is High, thereby VSS is outputted to OUT(1), whereas the transistor 72is turned off when CK2 is Low, thereby nothing is outputted to OUT(1).The transistor 73 is turned on when CK3 inputted from the input terminal54 is High, thereby VSS is outputted to OUT(1), whereas the transistor73 is turned off when CK3 is Low, thereby nothing is outputted toOUT(1). In this manner, the circuit 62 has a function to output Low toOUT(1) when either of CK2 or CK3 is High and of which output becomes afloating state when CK2 and CK3 are Low. Further, another circuitconfiguration having the same function may be employed instead of theaforementioned circuit configuration.

It is to be noted that one of the source and the drain of each of thetransistor 72 and the transistor 73 may be connected to a signal line,for example, to a signal line such as CK1, CK2, CK3, and SSP, anothersignal line, or another power source line. Further, a gate of thetransistor 72 may be connected to a power source line, for example, to apower source line such as the positive power source VDD and the negativepower source VSS, another power source line, or another signal line. Agate of the transistor 73 may be connected to a power source line, forexample, to a power source line such as the positive power source VDDand the negative power source VSS, another power source line, or anothersignal line.

That is, in the configurations shown in FIGS. 6 and 7, a firsttransistor (the transistor 31), a second transistor (the transistor 32),a third transistor (the transistor 71), a fourth transistor (thetransistor 72), and a fifth transistor (the transistor 73) are provided.One of a source and a drain of the first transistor is connected to afirst wire (VDD), the other of the source and the drain is connected tothe gate electrode of the second transistor and the other of a sourceand a drain of the third transistor, a gate electrode of the firsttransistor is connected to a fifth wire (the input terminal 51), one ofa source and a drain of the second transistor is connected to a thirdwire (the input terminal 52), the other of the source and the drain isconnected to a sixth wire (the output terminal 55), one of the sourceand the drain of the third transistor is connected to a second wire(VSS), the other of the source and the drain thereof is connected to agate electrode of the second transistor, a gate electrode of the thirdtransistor is connected to a fourth wire (the input terminal 53), one ofa source and a drain of the fourth transistor is connected to the secondwire (VSS), the other of the source and the drain of the fourthtransistor is connected to a sixth wire (the output terminal 55), and agate electrode thereof is connected to the fourth wire (the inputterminal 53), one of a source and a drain of the fifth transistor isconnected to the second wire (VSS), the other of the source and thedrain thereof is connected to the sixth wire (the output terminal 55),and a gate electrode thereof is connected to a seventh wire (the inputterminal 54). Further, one of the source and the drain of the firsttransistor may be connected to a fifth wire (the input terminal 51).

In the shift register circuit as described above, VSS can be supplied tothe output terminal 55 as either of CK2 or CK3 becomes High. That is, byinputting VSS at regular intervals in a non-selection period, a noisecan be reduced. Moreover, as there is no transistor which is stationaryon, characteristics deterioration of the transistor can be suppressed.In addition, as compared to Embodiment Mode 1, VSS can be supplied tothe output terminal 55 for a period twice as long, as shown in thenon-selection period. Therefore, a noise can be further suppressed.

Hereinafter described are some configuration examples and operationexamples of this embodiment mode, which are variable. The configurationexamples and the operation examples described below can be applied to“SUMMARY OF THE INVENTION”, embodiment modes, and embodiments. Theconfiguration example and the operation example described in EmbodimentMode 1 can be applied to this embodiment mode.

As shown in FIG. 6, a capacitor may be provided between the node P, andVSS or VDD. By connecting the capacitor, a potential of the node P canbe stabilized.

In FIG. 6, the capacitor 33 is connected for a boot strap operation.However, if there is capacitance between the gate and the other of thesource and the drain of the transistor 32, or the like, which is largeenough for the boot strap operation, the capacitor 33 is not alwaysrequired to be provided. Moreover, the capacitor 33 may be formedanywhere. For example, the capacitor may be formed between an amorphoussemiconductor layer and a gate wiring layer or between a semiconductorlayer and a wire. It is advantageous to form a capacitor between asemiconductor layer and a gate wiring layer since the capacitor can beformed with a thin G1 film (gate insulating film) interposedtherebetween regardless of a bottom gate transistor or a top gatetransistor, which enables to obtain more capacitance with a smallerarea.

It is to be noted in FIG. 6 that the circuit 61 is not always required.That is, as VSS is outputted at regular intervals by the circuit 62, thetransistor 32 is to be turned off even when the node P has a noise. As aresult, the number of elements can be reduced. At that time, a capacitormay be connected between the node P, and VSS or VDD.

An output of the circuit 50 of a stage may be inputted to the inputterminal of the circuit 62, an output of the circuit 50 of a followingstage may be inputted to the input terminal of the circuit 35 similarly,or an output of the circuit 50 of a following stage may be inputted tothe input terminals of the circuits 61 and 62. By using the output ofthe circuit 50 of a following stage, the signal can be synchronized notonly with a control signal but with an actual output of the shiftregister as well; therefore, there is an advantage in that a potentialcan be changed in accordance with an operation of the shift registercircuit.

As shown in FIG. 6, a capacitor may be connected between the node P, andVSS or VDD. By connecting the capacitor, a potential of the node P canbe stabilized.

Embodiment Mode 3

In this embodiment mode, description is made with reference to FIGS. 2,5, and 8 to 10 of a configuration and an operation of a shift registercircuit in which a noise in an output voltage in a non-selection periodis reduced by outputting VSS in the non-selection period.

The configuration of the shift register circuit shown in FIG. 5 and anoperation thereof can be similar to those described in Embodiment Mode2.

Description is made of a configuration of SR(1) as the circuit 50 of afirst stage with reference to FIG. 8. The circuit 50 shown in FIG. 8 isconfigured with the input terminal 51, the input terminal 52, the inputterminal 53, the input terminal 54, the output terminal 55, thetransistor 31, the transistor 32, the capacitor 33, a circuit 81, acircuit 82, and a circuit 83.

The input terminal 51, the input terminal 52, the input terminal 53, theinput terminal 54, the output terminal 55, the transistor 31, thetransistor 32, and the capacitor 33 are similar to those shown in FIG.5.

The circuit 81 has a function to output Low to a node P when CK2 is Highand of which output becomes a floating state when CK2 is Low. Thecircuit 82 has a function to output Low to the output terminal 55 whenan output of the circuit 83 is High and any one of CK1, CK2, and CK3 isHigh, and of which output becomes a floating state when CK1, CK2, andCK3 are Low. The circuit 83 has a function to output Low to the circuit82 when a potential of the node P is around VDD or equal to or higherthan VDD and output High to the circuit 82 when the potential of thenode P is VSS.

Connections of a circuit shown in FIG. 8 are described. The gate of thetransistor 31 is connected to the input terminal 51, one of the sourceand the drain thereof is connected to VDD, and the other of the sourceand the drain thereof is connected to one electrode of the capacitor 33,the gate of the transistor 32, an input terminal of the circuit 83, andan output terminal of the circuit 81, that is to the node P. One of thesource and the drain of the transistor 32 is connected to the inputterminal 52, the other of the source and the drain is connected to anoutput terminal of the circuit 82, the other terminal of the capacitor33, and the output terminal 55. The input terminal 52 is connected to aninput terminal of the circuit 82, the input terminal 53 is connected toan input terminal of the circuit 81 and the input terminal of thecircuit 82. The input terminal 54 is connected to the input terminal ofthe circuit 82. An output terminal of the circuit 83 is connected to theinput terminal of the circuit 82.

Description is made of an operation of the circuit shown in FIG. 8 inthe periods T1, the period T2, and the period T3 separately withreference to the timing chart of this embodiment mode shown in FIG. 2.Moreover, potentials of the node P and OUT(1) are VSS in an initialstate.

In the period T1, SSP becomes High, CK1 becomes Low, CK2 becomes Low,and CK3 becomes High. A gate potential of the transistor 31 at this timeis VDD, that of one of the source and the drain thereof is VDD, and thatof the other of the source and the drain thereof is VSS. Therefore, thetransistor 31 is turned on and the potential of the node P starts risingfrom VSS. The rise of the potential of the node P stops when it becomesa potential lower than VDD by a threshold voltage of the transistor 31,thereby the transistor 31 is turned off. A potential of the node P atthis time is Vn1. Further, as CK2 is Low, the output of the circuit 81is in a floating state. Therefore, as a charge is not supplied to thenode P, the node P becomes a floating state. As the circuit 83 outputsLow, CK1 is Low, CK2 is Low, and CK3 is High, the circuit 82 outputsLow. A gate potential of the transistor 32 at this time is Vn1, apotential of one of the source and the drain thereof is VSS, and theother of the source and the drain thereof is VSS, thus the transistor 32is on. However, as the potential of one of the source and the drain andthe potential of the other thereof are the same, there is no move incharge, thereby no current flows and no potential changes. The capacitor33 holds a potential difference between VSS as the potential of theoutput terminal 55 and Vn1 as the potential of the node P.

In the period T2, SSP becomes Low, CK1 becomes High, CK2 becomes Low,and CK3 becomes Low. The gate potential of the transistor 31 at thistime is VSS, that of one of the source and the drain thereof is VDD, andthat of the other of the source and the drain thereof is Vn1, therebythe transistor 31 is turned off. As CK2 is Low, the output of thecircuit 61 becomes a floating state. As a potential of the node P isVn1, the circuit 83 outputs Low to the input terminal of the circuit 82.As the output of the circuit 83 is Low, CK1 is High, CK2 is Low, and CK3is Low, the output of the circuit 82 becomes a floating state. The gatepotential of the transistor 32 at this time is Vn1, that of one of thesource and the drain thereof is VDD, and that of the other of the sourceand the drain thereof, that is a potential of the output terminal 55becomes VSS, thereby the transistor 32 is turned on and the potential ofthe output terminal 55 starts rising. Then, the capacitor 33 which isconnected between the gate and the other of the source and the drain ofthe transistor 32 holds the potential difference held in the period T1as it is; therefore, when a potential of the other of the source and thedrain rises, a gate voltage rises at the same time. A potential of thenode P is Vn2 at this time. When the potential of the node P rises ashigh as the sum of VDD and a threshold voltage of the transistor 32, therise of the potential of the output terminal 55 stops at VDD which isthe same as CK1. In other words, by the boot strap operation, thepotential of the output terminal 55 can be raised as high as VDD whichis a High potential of CK1.

In the period T3, SSP is Low, CK1 is Low, CK2 is High, and CK3 is Low.At this time, the potential of the node P becomes VSS as CK2 is High andVSS is outputted from the circuit 81, thereby the circuit 83 outputsHigh to the input terminal of the circuit 82. The potential of OUT(1)becomes VSS as VSS is outputted from the circuit 82. The gate potentialof the transistor 31 at this time becomes VSS, that of one of the sourceand the drain becomes VDD, and that of the other of the source and thedrain thereof becomes VSS, thereby the transistor 31 is turned off. Thegate potential of the transistor 32 becomes VSS, that of one of thesource and the drain thereof becomes VSS, and that of the other of thesource and the drain becomes VSS, thereby the transistor 32 is turnedoff.

By the operations in the periods T1, T2, and T3 described above, OUT(1)is outputted in the period 12 when SSP is inputted in the period T1.That is, the shift register is configured by connecting n stages of thecircuits 50 each of which outputs SSP with a shift of one-third of thecycle of the clock signal.

The description has been made of the circuit 50 of the first stage shownin FIG. 8, but now description is made of the circuit of the n-th stagewith reference to FIG. 53.

In FIG. 53, the transistors 31 and 32, the capacitor 33, the circuits81, 82, and 83, the input terminals 51, 52, 53, and 54, and the outputterminal 55 are similar to those shown in FIG. 8. A feature of thecircuit is that an input signal inputted from the input terminal 51 isconnected to the output terminal 55 of a circuit of a preceding stage.

The transistors used in the shift register circuit shown in FIG. 8 areall n-channel transistors, thus forming a unipolar circuit, however,only p-channel transistors may be used as well. It is needless to saythat a p-channel transistor and an n-channel transistor may be used incombination. A shift register circuit where all the transistors arep-channel transistors is described with reference to FIG. 57.

In a circuit configuration shown in FIG. 57, the positive power sourceVDD, the negative power source VSS, the input terminals 51, the inputterminal 52, the input terminal 53, the input terminal 54, thetransistor 551, the transistor 552, and the capacitor 553 can be similarto those in FIG. 55. A circuit 571 has a function to output High to thenode P when CK2 is Low and of which output becomes a floating state whenCK2 is High. A circuit 572 outputs High to the output terminal 55 whenany one of CK1, CK2, and CK3 is Low.

Connections of a circuit shown in FIG. 57 are described. The gate of thetransistor 551 is connected to the input terminal 51, one of the sourceand the drain thereof is connected to the positive power source VSS, theother of the source and the drain thereof is connected to one electrodeof the capacitor 553, the gate of the transistor 552, and the outputterminal of the circuit 571, that is to the node P. One of the sourceand the drain of the transistor 552 is connected to the input terminal52, the other of the source and the drain thereof is connected to anoutput terminal of the circuit 572, the other electrode of the capacitor553, and the output terminal 55. The input terminal 52 is connected toan input terminal of the circuit 572. The input terminal 53 is connectedto an input terminal of the circuit 571 and a first input terminal ofthe circuit 572. The input terminal 54 is connected to a second inputterminal of a first transistor in the circuit 572.

It is to be noted that the gate of the transistor 551 and the other ofthe source and the drain of the transistor 552 may be connected to apower source line, for example, to a power source line such as apositive power source VDD and a negative power source VSS, another powersource line, or another signal line. Further, the other of the sourceand the drain of the transistor 551 may be connected to a signal line,for example, to a signal line such as CK1, CK2, CK3, and SSP, anothersignal line, or another power source line.

Next, a configuration example of the circuit 81 shown in FIG. 8 isdescribed with reference to FIG. 9A.

In the circuit 81 shown in FIG. 9A, the input terminal 53 and the node Pare similar to those in FIG. 8. A transistor 91 is an n-channeltransistor formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor.

Connections of the circuit shown in FIG. 9A are described. A gate of thetransistor 91 is connected to the input terminal 53, one of a source anda drain thereof is connected to VSS, and the other of the source and thedrain thereof is connected to a node P.

An operation of the circuit shown in FIG. 9A is described. Thetransistor 91 is turned on when CK2 inputted from the input terminal 53is High, thereby VSS is outputted to the node P, whereas the transistor91 is turned off when CK2 is Low, thereby nothing is outputted to thenode P. In this manner, the circuit 91 has a function to output Low whenCK2 is High and of which output becomes a floating state when CK2 isLow. Further, another circuit configuration having the same function maybe employed instead of the aforementioned circuit configuration. FIG. 61shows a configuration example of the case where a p-channel transistoris used. Such a change can be easily accomplished by those skilled inthe art.

It is to be noted that one of the source and the drain of the transistor91 may be connected to a signal line, for example, to a signal line suchas CK1, CK2, CK3, and SSP, another signal line, or another power sourceline. Further, a gate of the transistor 91 may be connected to a powersource line, for example, to a power source line such as a positivepower source VDD and a negative power source VSS, another power sourceline, or another signal line.

Next, a configuration example of the circuit 82 shown in FIG. 8 isdescribed with reference to FIG. 9B.

In the circuit 82 shown in FIG. 9B, the input terminals 52, 53, and 54,and OUT(I) are similar to those in FIG. 8. Transistors 92, 93, 94, and95 are n-channel transistors formed of an amorphous semiconductor, apolycrystal semiconductor, or a single crystal semiconductor. Vout is anoutput of the circuit 82.

Connections of the circuit shown in FIG. 9B are described. A gate of thetransistor 95 is connected to Vout, one of a source and a drain thereofis connected to the input terminal 52, and the other of the source andthe drain thereof is connected to the gate of a transistor 92. One of asource and a drain of the transistor 92 is connected to VSS and theother of the source and the drain thereof is connected to the outputterminal 55. A gate of the transistor 93 is connected to the inputterminal 53, one of a source and a drain thereof is connected to VSS,and the other of the source and the drain thereof is connected to theoutput terminal 55. A gate of the transistor 94 is connected to theinput terminal 54, one of a source and a drain thereof is connected toVSS, and the other of the source and the drain thereof is connected tothe output terminal 55.

An operation of the circuit shown in FIG. 9B is described. Thetransistor 95 is turned on when Vout is inputted from the output of thecircuit 82 is High, thereby CK1 is transmitted to the gate of thetransistor 92, whereas the transistor 95 is turned off when Vout is Low,thereby CK1 is not transmitted to the gate of the transistor 92, whichremains in the former state. Here, when the transistor 95 is turned onand CK1 inputted from the input terminal 52 is High, the transistor 92is turned on and outputs VSS to OUT(1), whereas the transistor 92 isturned off when CK1 is Low, thereby nothing is outputted to OUT(1). Thetransistor 93 is turned on when CK2 inputted from the input terminal 53is High, thereby VSS is outputted to OUT(1), whereas the transistor 93is turned off when CK2 is Low, thereby nothing is outputted to OUT(1).The transistor 94 is turned on when CK3 inputted from the input terminal54 is High, thereby VSS is outputted to OUT(1), whereas the transistor94 is turned off when CK3 is Low, thereby nothing is outputted toOUT(1). In this manner, the circuit 82 has a function to output Low tothe output terminal 55 when the circuit 82 outputs High and CK1 is High,or either CK2 or CK3 is High, and of which output becomes a floatingstate when CK1, CK2, and CK3 are Low, and a function to output Low tothe output terminal 55 when the circuit 83 outputs Low and either of CK2or CK3 is High and of which output becomes a floating state when CK2 andCK3 are Low. Further, another circuit configuration having the samefunction may be employed instead of the aforementioned circuitconfiguration.

It is to be noted that one of the source and the drain of the transistor92, one of the source and the drain of the transistor 93, and one of thesource and the drain of the transistor 94 may be connected to a signalline, for example, to a signal line such as CK1, CK2, CK3, and SSP,another signal line, or another power source line. Further, one of thesource and the drain of the transistor 95, the gate of the transistor92, the gate of the transistor 93, and the gate of the transistor 94 maybe connected to a power source line, for example, a power source linesuch as the positive power source VDD and the negative power source VSS,another power source line, or another signal line.

Next, a configuration example of the circuit 83 shown in FIG. 8 isdescribed with reference to FIG. 10A.

In the circuit 83 shown in FIG. 10A, a node P and Vout are similar tothose in FIG. 8. A transistor 101 is an n-channel transistor formed ofan amorphous semiconductor, a polycrystal semiconductor, or a singlecrystal semiconductor. A resistor 102 has a resistive component. Anylinear element or non-linear element may be used as long as it has aresistive component. For example, a diode-connected transistor may beused.

A configuration example in which a transistor is used as the resistor102 is described with reference to FIG. 48. A node P, Vout, thetransistor 101, the positive power source VDD, and the negative powersource VSS are similar to those in FIG. 10. A transistor 481 is ann-channel transistor formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor. One of a source and adrain of the transistor 481 is connected to the positive power sourceVDD, the other of the source and the drain thereof is connected to Vout,and a gate thereof is connected to one of the source and the drain,thereby the transistor 481 is diode-connected. Vout is a potentialobtained by subtracting a threshold voltage of the transistor 481 fromVDD, unless a charge is supplied from VSS through the transistor 101which is turned on. In this manner, when the node P becomes Low, thetransistor 101 is turned off and the potential of Vout becomes apotential obtained by subtracting the threshold voltage of thetransistor 481 from VDD, whereas the potential of Vout becomes as highas VSS when the node P becomes High and the transistor 101 is turned on.

Connections of the circuit shown in FIG. 10A are described. A gate ofthe transistor 101 is connected to the node P, one of a source and adrain of the transistor 101 is connected to one terminal of the resistor102 and Vout, and the other of the source and the drain thereof isconnected to VSS. The other terminal of the resistor 102 is connected toVDD.

An operation of the circuit shown in FIG. 10A is described. Thetransistor 101 is turned on when the potential of the node P is equal toor higher than the sum of VSS and a threshold voltage of the transistor101, thereby VSS is outputted to Vout. The transistor 101 is turned offwhen the potential of the node P is lower than the sum of VSS and thethreshold voltage of the transistor 101, thereby VDD is outputted toVout through the resistor 102. In this manner, the circuit 83 has afunction to output Low to the input terminal of the circuit 82 when thepotential of the node P is equal to or higher than the sum of VSS andthe threshold voltage of the transistor 101 and output High to the inputterminal of the circuit 82 when the potential of the node P is lowerthan the sum of VSS and the threshold voltage of the transistor 101.Further, another circuit configuration having the same function may beemployed instead of the aforementioned circuit configuration. FIG. 62shows a configuration example which corresponds to the configurationexample shown in FIG. 10 using a p-channel transistor.

It is to be noted that the other of the source and the drain of thetransistor 101 may be connected to a signal line, for example, to asignal line such as CK1, CK2, CK3, and SSP, another signal line, oranother power source line. Further, the gate of the transistor 101 maybe connected to a power source line, for example, to a power source linesuch as a positive power source VDD and a negative power source VSS,another power source line, or another signal line.

Another configuration example of the circuit 83 shown in FIG. 8 isdescribed with reference to FIG. 10B.

As shown in the circuit 83 shown in FIG. 10B, the node P and Vout aresimilar those in FIG. 8. OUT(2) is an output of the circuit 50 of thenext second stage. For example, if the circuit 83 is the circuit 50 ofthe n-th stage, OUT(2) thereof corresponds to an output of the circuit50 of a (n+1)th stage. The transistors 102 and 103 are n-channeltransistors formed of an amorphous semiconductor, a polycrystalsemiconductor, or a single crystal semiconductor. A capacitor 104 hastwo electrodes.

Connections of the circuit shown in FIG. 10B are described. A gate ofthe transistor 102 is connected to OUT(2), one of a source and a drainthereof is connected to VDD, and the other of the source and the drainthereof is connected to one of a source and a drain of the transistor103, one electrode of the capacitor 104, and Vout. A gate of thetransistor 103 is connected to the node P and the other of the sourceand the drain thereof is connected to VSS. The other electrode of thecapacitor 104 is connected to VSS.

An operation of the circuit shown in FIG. 10B is described. Thetransistor 103 is turned on when the potential of the node P is equal toor higher than the sum of VSS and the threshold voltage of thetransistor 103, thereby VSS is outputted to Vout. The transistor 103 isturned off when the potential of the node P is lower than the sum of VSSand the threshold voltage of the transistor 103, thereby the output ofthe circuit 83 becomes a floating state. The transistor 102 is turned onwhen OUT(2) is High, thereby a voltage corresponding to a differencebetween VDD and a threshold voltage of the transistor 102 is outputtedto Vout. The transistor 102 is turned off when OUT(2) is Low, therebythe output of the circuit 83 becomes a floating state. That is, Voutoutputs Low when the potential of the node P is around, equal to, orhigher than VDD, whereas Vout outputs High when the potential of thenode P is VSS. Further, another circuit configuration having the samefunction may be employed instead of the aforementioned circuitconfiguration.

The gate of the transistor 102 and the gate of the transistor 103 may beconnected to a power source line, for example, to a power source linesuch as the positive power source VDD and the negative power source VSS,another power source line, or another signal line. Further, the other ofthe source and the drain of the transistor 103 may be connected to asignal line, for example, a signal line such as CK1, CK2, CK3, and SSP,another signal line, or another power source line.

In the shift register as described above, VSS can be supplied to theoutput terminal 55 when any one of CK1, CK2, and CK3 is High as in anon-operation period. That is, as VSS is supplied to the output terminal55 in the non-selection period, a potential can be stabilized, a noisecan be reduced, and there is no transistor which is stationary on;therefore, characteristics deterioration can be suppressed. Further, bysupplying VSS to the node P at regular intervals, the transistor 32 canbe surely turned off.

Hereinafter described are some configuration examples and operationexamples of this embodiment mode, which are variable. The configurationexamples and the operation examples described below can be applied to“SUMMARY OF THE INVENTION”, embodiment modes, and embodiments. Theconfiguration examples and the operation examples described inEmbodiment Mode 1 can be applied to this embodiment mode.

As shown in FIGS. 9A and 9B, the gate of the transistor 92 is in afloating state when the transistor 95 is off. Therefore, when the gatecapacitance of the transistor 92 holding a potential is not largeenough, a capacitor may be additionally connected. In that case, thecapacitor is preferably connected between the gate of the transistor 92,and VDD or VSS.

As shown in FIG. 10B, the capacitor 104 is connected to Vout, however,the capacitor 104 may be omitted when an element connected to Vout hasenough capacitance. By omitting the capacitor 104 connected to Vout, afaster operation can be realized.

As shown in FIG. 10B, the node P is connected to the gate of thetransistor 103, however, the input terminal 51 may be connected thereto.By connecting the input terminal 51, there is no period when thetransistors 102 and 103 are simultaneously turned on, and thus a throughcurrent which flows through the transistors 102 and 103 is notgenerated. As a result, a malfunction does not easily occur and powerconsumption can be reduced.

Embodiment Mode 4

In this embodiment mode, description is made with reference to FIGS. 2,5, 11, and 12 of a configuration and an operation of a shift registercircuit in which a noise of an output voltage in a non-selection periodis reduced by outputting VSS at regular intervals.

A configuration and an operation of a shift register circuit shown inFIG. 5 can be similar to those described in Embodiment Mode 2.

Description is made of a configuration of SR(1) as the circuit 50 of afirst stage with reference to FIG. 11. The circuit 50 shown in FIG. 11is configured with the input terminal 51, the input terminal 52, theinput terminal 53, the input terminal 54, the output terminal 55, thetransistor 31, the transistor 32, the capacitor 33, a circuit 111, thecircuit 82, and the circuit 83. The input terminals 51, 52, 53, and 54,the output terminal 55, the circuits 82 and 83, the transistors 31 and32, the capacitor 33, and the node P are similar to those shown in FIG.8.

The circuit 111 outputs Low to the node P when the circuit 83 outputsHigh and any one of CK1, CK2, and CK3 is High, whereas an output thereofbecomes a floating state when CK1, CK2, and CK3 are Low. The circuit 111has a function to output Low to the node P when the circuit 83 outputsLow and CK2 is High and of which output becomes a floating state whenCK2 is Low.

Connections of the circuit shown in FIG. 11 are described. The gate ofthe transistor 31 is connected to the input terminal 51, one of thesource and the drain thereof is connected to VDD, the other of thesource and the drain thereof is connected to one electrode of thecapacitor 33, the gate of the transistor 32, the input terminal of thecircuit 83, and the output terminal of the circuit 111, that is the nodeP. One of the source and the drain of the transistor 32 is connected tothe input terminal 52, the other of the source and the drain thereof isconnected to the output terminal of the circuit 82, the other electrodeof the capacitor 33, and the output terminal 55. The input terminal 52is connected to the input terminal of the circuit 82 and the inputterminal of the circuit 111, the input terminal 53 is connected to theinput terminal of the circuit 82 and the input terminal of the circuit111, and the input terminal 54 is connected to the input terminal of thecircuit 82 and the input terminal of the circuit 111. The outputterminal of the circuit 83 is connected to the input terminal of thecircuit 82 and the input terminal of the circuit 111.

Description is made of an operation of the circuit shown in FIG. 11 inthe period T1, the period T2, and the period T3 separately withreference to the timing chart of this embodiment mode shown in FIG. 2.Moreover, potentials of the node P and OUT(1) are VSS in an initialstate.

In the period T1, SSP becomes High, CK1 becomes Low, CK2 becomes Low,and CK3 becomes High. A gate potential of the transistor 31 at this timeis VDD, that of one of the source and the drain thereof is VDD, and thatof the other of the source and the drain thereof is VSS. Therefore, thetransistor 31 is turned on and the potential of the node P starts risingfrom VSS. The rise of the potential of the node P stops when it becomesa potential lower than VDD by a threshold voltage of the transistor 31,thereby the transistor 31 is turned off. A potential of the node P atthis time is Vn1. As the potential of the node P is Vn1, the circuit 83outputs Low to the input terminals of the circuits 82 and 83. The outputof the circuit 111 becomes a floating state as the circuit 83 outputsLow, CK1 is Low, CK2 is Low, and CK3 is High. The circuit 82 outputs Lowto the output terminal 55 as the circuit 83 outputs Low, CK1 is Low, CK2is Low, and CK3 is High. The capacitor 33 holds a potential differencebetween VSS as the potential of the output terminal 55 and Vn1 as thepotential of the node P.

In the period T2, SSP becomes Low, CK1 becomes High, CK2 becomes Low,and CK3 becomes Low. The gate potential of the transistor 31 at thistime is VSS, that of one of the source and the drain thereof is VDD, andthat of the other of the source and the drain thereof is Vn1, therebythe transistor 31 is turned off. As a potential of the node P is Vn1,the circuit 83 outputs Low to the input terminal of the circuit 82 andthe input terminal of the circuit 111. As the output of the circuit 83is Low, CK1 is High, CK2 is Low, and CK3 is Low, the output of thecircuit 111 becomes a floating state. As the output of the circuit 83 isLow, CK1 is High, CK2 is Low, and CK3 is Low, an output of the circuit82 becomes a floating state. The gate potential of the transistor 32 atthis time is Vn1, that of one of the source and the drain thereof isVDD, and that of the other of the source and the drain thereof, that isa potential of the output terminal 55 becomes VSS, thereby thetransistor 32 is turned on and the potential of the output terminal 55starts rising. Then, the capacitor 33 which is connected between thegate and the other of the source and the drain of the transistor 32holds the potential difference held in the period T1 as it is;therefore, when a potential of the other of the source and the drainrises, a gate potential rises at the same time. A potential of the nodeP is Vn2 at this time. When the potential of the node P rises as high asthe sum of VDD and a threshold voltage of the transistor 32, the rise ofthe potential of the output terminal 55 stops at VDD which is the sameas CK1. In other words, by the boot strap operation, the potential ofthe output terminal 55 can be raised as high as VDD which is a Highpotential of CK1.

In the period T3, SSP is Low, CK1 is Low, CK2 is High, and CK3 is Low.At this time, the potential of the node P becomes VSS as CK2 is High andVSS is outputted from the circuit 111, thereby the circuit 83 outputsHigh to the input terminal of the circuit 82. The potential of OUT(I)becomes VSS as VSS is outputted from the circuit 82. The gate potentialof the transistor 31 at this time becomes VSS, that of one of the sourceand the drain becomes VDD, and that of the other of the source and thedrain thereof becomes VSS, thereby the transistor 31 is turned off. Thegate potential of the transistor 32 becomes VSS, that of one of thesource and the drain thereof becomes VSS, and that of the other of thesource and the drain becomes VSS, thereby the transistor 32 is turnedoff.

By the operations in the periods T1, T2, and T3 described above, OUT(1)is outputted in the period T2 when SSP is inputted in the period T1.That is, the shift register circuit is configured by connecting n stagesof the circuits 50 which outputs SSP with a shift of one-third of thecycle of the clock signal.

The transistors used in the shift register circuit shown in FIG. 11 areall n-channel transistors, thus forming a unipolar circuit, however,only p-channel transistors may be used as well. It is needless to saythat a p-channel transistor and an n-channel transistor may be used incombination. A shift register circuit where all the transistors arep-channel transistors is described with reference to FIG. 58.

In a circuit configuration shown in FIG. 58, the positive power sourceVDD, the negative power source VSS, the input terminal 51, the inputterminal 52, the input terminal 53, the input terminal 54, thetransistor 551, the transistor 552, and the capacitor 553 can be similarto those in FIG. 55. The circuits 572 and 573 can be similar to those inFIG. 57. A circuit 581 outputs High to the output terminal 55 when anyone of CK1, CK2, and CK3 is Low.

Connections of the circuit shown in FIG. 58 are described. The gate ofthe transistor 551 is connected to the input terminal 51, one of thesource and the drain thereof is connected to the positive power sourceVSS, the other of the source and the drain thereof is connected to oneelectrode of the capacitor 553, the gate of the transistor 552, and theoutput terminal of the circuit 581, that is the node P. One of thesource and the drain of the transistor 552 is connected to the inputterminal 52, the other of the source and the drain thereof is connectedto the output terminal of the circuit 572, the other electrode of thecapacitor 553, and the output terminal 55. The input terminal 52 isconnected to the input terminal of the circuit 572. The input terminal53 is connected to the input terminal of the circuit 581 and a firstinput terminal of the circuit 572. The input terminal 54 is connected toa second input terminal of a first transistor of the circuit 562.

It is to be noted that the gate of the transistor 551 and the other ofthe source and the drain of the transistor 552 may be connected to apower source line, for example, to a power source line such as apositive power source VDD and a negative power source VSS, another powersource line, or another signal line. Further, the other of the sourceand the drain of the transistor 551 may be connected to a signal line,for example, to a signal line such as CK1, CK2, CK3, and SSP, anothersignal line, or another power source line.

The description has been made of the circuit 50 of the first stage shownin FIG. 11, but now the circuit 56 of the n-th stage is described withreference to FIG. 54. In FIG. 54, the transistor 31, the transistor 32,the capacitor 33, the circuit 111, the circuit 82, the circuit 83, theinput terminal 51, the input terminal 52, the input terminal 53, theinput terminal 54, and the output terminal 55 are similar to thosedescribed in FIG. 11. A feature of the circuit 50 is that an inputsignal inputted from the input terminal 51 is connected to the outputterminal 55 of a circuit of a preceding stage.

Next, a configuration example of the circuit 111 shown in FIG. 11 isdescribed with reference to FIG. 12.

In the circuit 111 shown in FIG. 12, the input terminal 52, the inputterminal 53, the input terminal 54, and OUT(1) are similar to those inFIGS. 5 and 11. A transistor 121, a transistor 122, a transistor 123, atransistor 124, and a transistor 125 are n-channel transistors formed ofan amorphous semiconductor, a polycrystal semiconductor, or a singlecrystal semiconductor. Vout is an output of the circuit 111.

Connections of a circuit shown in FIG. 12 are described. A gate of thetransistor 124 is connected to Vout, one of a source and a drain thereofis connected to the input terminal 52, and the other of the source andthe drain thereof is connected to a gate of the transistor 121. One of asource and a drain of the transistor 121 is connected to VSS and theother of the source and the drain thereof is connected to the node P. Agate of the transistor 122 is connected to the input terminal 53, one ofa source and a drain thereof is connected to VSS, and the other of thesource and the drain thereof is connected to the node P. A gate of thetransistor 125 is connected to Vout, one of a source and a drain thereofis connected to the input terminal 54, and the other of the source andthe drain thereof is connected to a gate of the transistor 123. One of asource and a drain of the transistor 123 is connected to VSS and theother of the source and the drain thereof is connected to the node P.

An operation of the circuit shown in FIG. 12 is described. Thetransistors 124 and 125 are turned on when Vout inputted from an outputof the circuit 83 is High, thereby CK1 is transmitted to the gate of thetransistor 121 and CK3 is transmitted to the gate of the transistor 123.The transistors 124 and 125 are turned off when Vout is Low, thereby CK1is not transmitted to the gate of the transistor 121, which remains inthe former state. As CK3 is not transmitted to the gate of thetransistor 123, the transistor 123 remains in the former state. Here,the transistor 121 is turned on when the transistor 124 is turned on andCK1 inputted from the input terminal 52 is High, thereby VSS isoutputted to the node P, whereas the transistor 121 is turned off whenCK1 is Low, thereby nothing is outputted to the node P. The transistor122 is turned on when CK2 inputted from the input terminal 53 is High,thereby VSS is outputted to the node P, whereas the transistor 122 isturned off when CK2 is Low, thereby nothing is outputted to the node P.The transistor 123 is turned on when the transistor 125 is turned on andCK3 inputted from the input terminal 54 is High, thereby VSS isoutputted to the node P, whereas the transistor 123 is turned off whenCK3 is Low, thereby nothing is outputted to the node P. In this manner,the circuit 111 outputs Low to the output terminal 55 when the circuit83 outputs High and any one of CK1, CK2, and CK3 is High, and of whichoutput becomes a floating state when CK1, CK2, and CK3 are Low. Thus,the circuit 111 has a function to output Low to the output terminal 55when the circuit 83 outputs Low and CK2 is High and of which outputbecomes a floating state when CK2 is Low. Further, another circuitconfiguration having the same function may be employed instead of theaforementioned circuit configuration. FIG. 63 shows a configurationexample where a p-channel transistor is used.

It is to be noted that the other of the source and the drain of thetransistor 124, the gate of the transistor 121, the gate of thetransistor 122, one of a source and a drain of the transistor 125, andthe gate of the transistor 123 may be connected to a signal line, forexample, to a signal line such as CK1, CK2, CK3, and SSP, another signalline, or another power source line. Further, the other of the source andthe drain of the transistor 121, the other of the source and the drainof the transistor 122, and the other of the source and the drain of thetransistor 123 may be connected to a signal line, for example, to asignal line such as CK1, CK2, CK3, and SSP, another signal line, oranother power source line.

In the shift register circuit as described above, VSS can be supplied tothe output terminal 55 and the node P when any one of CK1, CK2, and CK3is High as in a non-operation period. That is, as VSS is always suppliedto the output terminal 55 and the node P in the non-selection period, apotential can be stabilized, a noise can be reduced, and there is notransistor which is stationary on; therefore, characteristicsdeterioration can be suppressed.

Hereinafter described are some configuration examples and operationexamples of this embodiment mode, which are variable. The configurationexamples and the operation examples described below can be applied to“SUMMARY OF THE INVENTION”, embodiment modes, and embodiments. Theconfiguration examples and the operation examples described inEmbodiment Mode 1 can be applied to this embodiment mode.

As shown in FIG. 12, a signal inputted to the gate of the transistor 121may be the same as a signal inputted to the gate of the transistor 92 inthe circuit 82. As a result, the number of transistors can be reduced.

As shown in FIG. 12, the gate of the transistor 121 is in a floatingstate when the transistor 124 is off. Therefore, when the gatecapacitance of the transistor 121 holding a potential is not largeenough, a capacitor may be additionally connected. In that case, thecapacitor is preferably connected between the gate of the transistor121, and VDD or VSS.

As shown in FIG. 12, the gate of the transistor 123 is in a floatingstate when the transistor 125 is off. Therefore, when the gatecapacitance of the transistor 123 holding a potential is not largeenough, a capacitor may be additionally connected. In that case, thecapacitor is preferably connected between the gate of the transistor123, and VDD or VSS.

Embodiment Mode 5

In this embodiment mode, some configuration examples of a circuit usingthe shift register circuit described in Embodiment Modes 1 to 4 aredescribed.

A configuration example of a gate driver which scans pixels by the shiftregister circuit described in Embodiment Modes 1 to 4 is described withreference to FIG. 13. A timing chart thereof is shown in FIG. 14.

A gate driver circuit shown in FIG. 13 is formed of a shift registercircuit 131 described in Embodiment Modes 1 to 4. Then, OUT1 to OUTnwhich are output signals outputted from the shift register circuit 131are transmitted as gate signals to pixels.

SSP, CK1, CK2, and CK3 as control signals are inputted to the shiftregister circuit 131, at a timing similar to those described inEmbodiment Modes 1 to 4 as shown in FIG. 14. As a power source, apositive power source VDD and a negative power source VSS are inputted.An amplitude voltage of the control signal corresponds to the positivepower source VDD and the negative power source VSS. When SSP is inputtedas shown in FIG. 14, gate signal lines are selected from OUT(1)sequentially (this operation is hereinafter also referred to asscanning). In this manner, an output of the shift register 131 isoutputted as a gate signal to gate signal lines G1 to Gn without change.

Here, it is preferable that a potential of the positive power source VDDis higher than a maximum value of a video signal of a pixel which isdescribed later, and a potential of the negative power source VSS islower than a minimum value of a video signal. In this manner, a videosignal can be surely written to a pixel; therefore, a display devicewith higher image quality can be provided.

The gate driver described in FIG. 13 outputs an output of the shiftregister circuit 131 as a gate signal without change. This isadvantageous in that an area of a gate driver portion is reduced.Further, as the number of elements in the gate driver portion is reducedas well, it is advantageous in that the yield can be enhanced.

Description is made with reference to FIG. 15 of a gate driver whichscans pixels by changing an amplitude voltage of an output signal of theshift register circuit described in Embodiment Modes 1 to 4. A timingchart thereof is shown in FIG. 16.

The gate driver circuit shown in FIG. 15 is configured with a shiftregister circuit 151 described in Embodiment Modes 1 to 4 and a levelshifter circuit 152. Then, OUT(1) to OUT(n) which are output signalsoutputted from the shift register circuit 151 through the gate signallines G1 to Gn are transmitted as gate signals through the level shiftercircuit 152.

The level shifter circuit 152 shown in FIG. 15 is described withreference to FIGS. 50A and 50B. The level shifter circuit shown in FIG.50 can be applied not only to the level shifter circuit 152 shown inFIG. 15, but also to the other drawings, embodiment modes, andembodiments.

In a level shifter circuit shown in FIG. 50A, OUT(n) as an output of theshift register circuit 151 of an n-th row, a power source VDDH of whichpotential is higher than a maximum value of an amplitude voltage ofOUT(n), a negative power source VSS, a resistor 502 with a resistivecomponent, and a transistor 501 are at least provided. OUT(n) isinputted to the gate of the transistor 501, one of one of a source and adrain thereof is connected to the negative power source VSS, the otherof the source and the drain thereof is connected to one terminal of theresistor 502 and a gate signal line, and the other terminal of theresistor 502 is connected to the power source VDDH.

In a level shifter circuit shown in FIG. 50B, OUT(n) as an output of theshift register circuit 151 of the n-th row, a power source VDDH of whichpotential is higher than a maximum value of an amplitude voltage ofOUT(n), a negative power source VSS, the transistor 503, the transistor504, and an inverter circuit 505 are at least provided. OUT(n) isinputted to a gate of the transistor 504 and OUT(n) which is invertedthrough the inverter circuit 505 is inputted to the gate of thetransistor 503. One of the source and the drain of the transistor 504 isconnected to the negative power source VSS and one of the source and thedrain of the transistor 503 is connected to the power source VDD. Theother of the source and the drain of the transistor 504 and the other ofthe source and the drain of the transistor 505 are connected to a gatesignal line.

SSP, CK1, CK2, and CK3 as control signals are inputted to the shiftregister circuit 151 at a timing similar to those in Embodiment Modes 1to 4, as shown in FIG. 16. As a power source, the positive power sourceVDD and the negative power source VSS are inputted. An amplitude voltageof a control signal is set corresponding to the positive power sourceVDD and the negative power source VSS. When SSP is inputted as shown inFIG. 16, the gate signal lines are sequentially selected from OUT(1)(this operation is hereinafter also referred to as scanning). In thismanner, an output of the shift register circuit 151 can be inputted tothe level shifter circuit 152. Amplitude of an output signal of theshift register circuit 151 at this time has a High potential being thepositive power source VDD and a Low potential being the negative powersource VSS.

The level shifter circuit 152 has a function to change an amplitudevoltage of the output signal of the shift register circuit 151 inputtedthereto. For example, when High is inputted, the level shifter circuit152 changes a potential from a potential of the positive power sourceVDD to that of the positive power source VDDH, whereas when Low isinputted, the level shifter circuit 152 changes a potential from thepotential of the negative power source VSS to that of the negative powersource VSSL to be outputted to the gate signal line. The potential ofthe positive power source VDDH is higher than that of the positive powersource VDD and the potential of the negative power source VSSL is lowerthan that of the negative power source VSS. Only an amplitude voltage ofthe High signal may be changed or only that of the Low signal may bechanged as well.

Here, it is preferable that the potential of the positive power sourceVDDH is higher than a maximum value of a video signal inputted to apixel which is described later and the potential of the negative powersource VSS is lower than a minimum value of the video signal. In thismanner, a video signal can be surely written to a pixel; therefore, adisplay device with higher image quality can be provided.

The gate driver shown in FIG. 15 outputs an output signal of the shiftregister circuit 151 to the gate signal line by changing an amplitudevoltage thereof through the level shifter circuit 152. In this manner,the shift register circuit 151 can be driven by a control signal with asmaller amplitude voltage and a power source. Therefore, it isadvantageous in reducing power consumption.

Description is made with reference to FIG. 17 of a gate driver circuitwhich inputs a control signal through a level shifter circuit to theshift register circuit described in Embodiment Modes 1 to 4. A timingchart thereof is shown in FIG. 18.

The gate driver circuit shown in FIG. 17 is configured with shiftregister circuits 171 and 172 described in Embodiment Modes 1 to 4, andtransmits output signals OUT1 to OUTn to the pixels, which are outputtedfrom the shift register circuit 151 through the gate signal lines G1 toGn.

The level shifter circuit 172 is a circuit for changing an amplitudevoltage of an inputted signal. For example, the level shifter circuit172 can change a High potential of the inputted signal to a potential ofthe positive power source VDD as a power source of the shift registercircuit 171 and change a Low potential thereof to a potential of thenegative power source VSS. In the case of FIG. 17, the amplitudevoltages of the controls signals SSP, CK1, CK2, and CK3 inputted to thelevel shifter circuit 172 can be changed to the amplitude voltagescorresponding to the positive power source VDD and the negative powersource VSS. That is, a control signal which is inputted with smallamplitude, for example, with amplitude of a known external circuit, canbe inputted to the shift register circuit 171 by changing an amplitudevoltage of the control signal through the level shifter circuit 172 toan amplitude voltage corresponding to the positive power source VDD andthe negative power source VSS. As a result, the gate driver circuitshown in FIG. 17 can be driven regardless of a use of an amplitudevoltage of an external circuit and there is no need to additionallydevelop an external circuit.

Therefore, it is advantageous in reducing the cost as a display device.

SSP, CK1, CK2, and CK3 which are changed to have amplitude voltagescorresponding to the positive power source VDD and the negative powersource VSS are inputted to the shift register circuit 171 at a similartiming to that shown in FIG. 18 as described in Embodiment Modes 1 to 4.As a power source, the positive power source VDD and the negative powersource VSS are inputted to the shift register circuit 171. As shown inFIG. 18, when SSP is inputted, the gate signal lines are sequentiallyselected from OUT(1). In this manner, an output of the shift registercircuit 171 is outputted to the gate signal lines G1 to Gn as they areas gate signals. That is, the gate signal lines are sequentiallyscanned.

Here, it is preferable that the potential of the positive power sourceVDD is higher than a maximum value of a video signal inputted to a pixelwhich is described later and the potential of the negative power sourceVSS is lower than a minimum value of the video signal. In this manner, avideo signal can be surely written to a pixel; therefore, a displaydevice with higher image quality can be provided.

Description is made with reference to FIG. 19 of a source driver circuitusing the shift register circuit described in Embodiment Modes 1 to 4. Atiming chart thereof is shown in FIG. 20.

The source driver circuit shown in FIG. 19 is configured with a shiftregister circuit 191 and switching elements 192 described in EmbodimentModes 1 to 4. By an output signal of the shift register circuit 191, theswitching elements 192 are sequentially turned on from SW1 as a firstcolumn to SWm. One terminal of the switching element 192 is connected toa video signal line which transmits a video signal and the otherterminal of the switching element 192 is connected to a source signalline; therefore, a video signal can be outputted to the source signalline when the switching element 192 is turned on. As shown in FIG. 20,the video signal changes in accordance with a source signal line of acolumn which is turned on. Thus, in all columns, an arbitrary videosignal can be outputted to the source signal line. As the source signallines are connected to pixels, video signals can be transmitted to thepixels.

Here, an output signal of the shift register circuit 192 is a 1-bitsignal of High and Low as described in Embodiment Modes 1 to 4. A Highpotential is a potential of the positive power source VDD while a Lowpotential is a potential of the negative power source VSS. The switchingelements 192 are controlled by outputs of the shift register circuit191. Therefore, the potentials of the positive power source VDD and thenegative power source VSS are required to be potentials which can surelyturn on or off the switching elements 192 regardless of the videosignals. That is, the potential of the positive power source VDD ispreferably higher than a maximum value of a potential of the videosignal, and the potential of the negative power source VSS is preferablylower than a minimum value of a potential of the video signal.Similarly, a control signal inputted to the shift register circuit 191is required to have an amplitude voltage corresponding to the potentialsof the positive power source VDD and the negative power source VSS.

It is preferable that the switching elements 192 is formed of n-channeltransistors. A gate of the n-channel transistor is connected to anoutput of the shift register circuit 191, one of a source and a drainthereof is connected to a video signal line, and the other of the sourceand the drain thereof is connected to a source signal line. In thismanner, the n-channel transistor is turned on when an output of theshift register circuit 191 is High, and an n-channel transistor can beturned off when an output of the shift register circuit 191 is Low. Byusing n-channel transistors as the switching elements 192, amorphoussilicon can be used to form a transistor. That is, there is an advantagein that the switching elements 192, a pixel portion, and a shiftregister circuit constituted only by n-channel transistors can be formedover the same substrate.

A type of a transistor applicable as a switching element to theinvention is not limited. A transistor used for the invention may be atransistor using a non-single crystal semiconductor film represented byamorphous silicon or polycrystal silicon, a MOS transistor formed byusing a semiconductor substrate or an SOI substrate, a junctiontransistor, a bipolar transistor, a transistor using an organicsemiconductor or a carbon nanotube, or the like. Furthermore, asubstrate over which a transistor is mounted is not exclusively limitedto a certain type. It may be a single crystal substrate, an SOIsubstrate, a quartz substrate, a glass substrate, a resin substrate, orthe like.

As a transistor is operated simply as a switching element, polarity(conductivity type) thereof is not particularly limited, and either ofan n-channel transistor or a p-channel transistor can be used. However,when an off-current is preferably smaller, a transistor with a lessoff-current is preferably used. As a transistor with a less off-current,there is a transistor having a region (referred to as an LDD region)between a channel forming region, and a source region or a drain region,to which an impurity element imparting a conductivity type is added at alow concentration.

It is preferable to use an n-channel transistor when the transistoroperates with a source potential closer to a low potential side powersource. On the contrary, it is preferable to use a p-channel transistorwhen the transistor operates with a source potential closer to a highpotential side power source. With such a configuration, an absolutevalue of a gate-source voltage of a transistor can be set large;therefore, the transistor can be easily operated as a switch. It is tobe noted that a CMOS switching element may be formed by using both ann-channel transistor and a p-channel transistor.

FIG. 19 shows one video signal line, however, a plurality of videosignal lines may be provided as well. For example, when two video signallines are provided, two switching elements 192 are controlled by anoutput signal of the shift register circuit 191, and another videosignal line is connected to each of the switching elements 192. As aresult, the two switching elements 192 are simultaneously turned on andanother video signal can be outputted to another source signal line.That is, with source signal lines of the same number of columns, thenumber of stages of the shift register circuit 191 can be reduced tohalf. Therefore, it is advantageous in that an area for forming theshift register circuit 191 can be reduced to half. Moreover, an yieldcan be expected to be improved since the number of elements is reducedas a whole.

As shown in FIG. 19, a level shifter circuit may be additionallyprovided between the output of the shift register circuit 191 and theswitching element 192. As a result, the shift register circuit 191 canbe operated with a small amplitude voltage, and an output signal of theshift register circuit 191 can be increased by the level shifter circuitto be inputted to the switching element 192. That is, power consumptioncan be reduced by operating the shift register circuit 191 with a smallamplitude voltage. By inputting an output signal of the shift registercircuit 191 to the switching element 192 through a level shiftercircuit, an amplitude voltage can be higher than the video signal.

As shown in FIG. 19, a control signal may be inputted to the shiftregister circuit 191 through a level shifter circuit. As a result, adisplay device of the invention can be driven by using a known externalcircuit. Moreover, a level shifter circuit may be connected to theoutput of the shift register circuit 191.

Embodiment Mode 6

In this embodiment mode, description is made of some configurationexamples of a display device using a gate driver and a source driverwhich have the shift register circuits described in Embodiment Modes 1to 4.

Description is made with reference to FIG. 21 of a configuration exampleof a display device in the case where the shift register circuitdescribed in Embodiment Modes 1 to 4 is used as a gate driver. Further,a control signal line, a power source line, a counter electrode, and thelike are not shown for convenience, however, they can be additionallyprovided as required. A gate driver can be additionally provided asrequired as well. Further, the gate driver described in Embodiment Mode5 is preferably used as a gate driver shown in FIG. 21.

The display device shown in FIG. 21 includes a gate driver 212, pixels211, gate signal lines G1 to Gn, and source signal lines S1 to Sm. Thegate signal lines for transmitting gate signals outputted from the gatedriver 212 and the source signal lines for transmitting video signalstransmitted from an external circuit control the pixels 211.

Each of the pixels 211 includes a display element such as a liquidcrystal element and a light emitting element such as an FED element andan EL element, and may include a switching element or a transistor forcontrolling the display element, a capacitor for holding a video signalor a threshold voltage of the transistor, and the like.

The gate driver 212 is a gate driver circuit which outputs a gate signalfor selecting the pixel 211 to which a video signal is written. When thepixel is selected, the gate signal lines are sequentially selected fromG1 to Gn. Further, it is preferable that an amplitude voltagetransmitted from the gate signal line to the pixel is higher than amaximum value and a minimum value of a potential of a video signal.Further, when a video signal is a current, it is preferable that thevideo signal has a higher amplitude voltage than a maximum value and aminimum value of a potential of the source signal line, which isdetermined by a flowing current. To select the gate signal line means tooutput a High signal from the gate driver 212. In a period when the gatesignal line is not selected, the gate driver 212 outputs a Low signal.

The source signal lines S1 to Sm are source signal lines fortransmitting video signals inputted from an external circuit to thepixels. The video signal may be inputted as an analog signal, a digitalsignal, a current, or a voltage. A source driver which outputs videosignals may be formed as an internal circuit and an output of the sourcedriver may be outputted to the source signal line. Further, a videosignal inputted to the source signal line may be inputted all columns atthe same time by a line sequential drive or divided video signals may beinputted per one column or a plurality of columns by a dot sequentialdrive.

FIG. 22 shows a configuration example of the case where a source driveris formed as an internal circuit. As shown in FIG. 22, the pixels 211,the gate driver 212, the gate signal lines, and the source signal linescan be similar to those in FIG. 21. The source driver 221 is a sourcedriver for outputting video signals by a dot sequential drive or a linesequential drive. A configuration of the source driver 221 may employthe configuration of the source driver described in Embodiment Mode 5.

As shown in the configuration example of the display device in FIG. 21,m video signals are required to be inputted to m columns of sourcesignal lines. When a display device has a higher resolution and a largersize, the number of video signals, that is the number of terminals towhich the video signals are inputted through an external circuit, anFPC, or the like is expected to be drastically increased accordingly. Inview of this, a period when a certain gate signal line is selected by agate driver (High is outputted) is divided into a plurality of periods,thereby a video signal is outputted to another source signal line in thedivided periods. Description is made with reference to FIG. 46 of aconfiguration example of a video signal input portion where the numberof terminals to which video signals are inputted is reduced. FIG. 47shows a timing chart of FIG. 46.

FIG. 46 shows an example of a video signal input portion of the displaydevice shown in FIG. 21. Other portions which are not shown, forexample, the pixels 211, the gate driver 212, and the like can besimilar to those in FIG. 21. Description is made with reference to FIG.46 of a configuration example of the case where the source signal linesare divided into R, C and B. In addition, two input terminals for videosignals and six source signal lines are provided for convenience,however, the invention is not limited to this and the number of theterminals and signal lines can be changed as required.

As shown in FIG. 46, a control signal line R, a control signal line G, acontrol signal line B, a video signal input terminal S1 (RGB), and avideo signal input terminal S2 (RGB) are input terminals to whichcontrols signals are externally inputted. A switching element SW1R and aswitching element SW2R are controlled to be turned on or off by acontrol signal line R. A switching element SWIG and a switching elementSW2G are controlled to be turned on or off by a control signal line G Aswitching element SW1B and a switching element SW2B are controlled to beturned on or off by a control signal line B. A source signal line S1-R,a source signal line S1-G, a source signal line S1-B, a source signalline S2-R, a source signal line S2-G, and a source signal line S2-B aresource signal lines for transmitting video signals to the pixels.

Connections of the circuit shown in FIG. 46 are described. The videosignal input terminal S1 (RGB) is connected to one terminal of theswitching element SW1R, one terminal of the switching element SWIG, andone terminal of the switching element SW1B. The other terminal of theswitching element SW1R is connected to the source signal line S1-R, theother terminal of the switching element SW1G is connected to the sourcesignal line S1-G, and the other terminal of the switching element SW1Bis connected to the source signal line S1-B. The video signal inputterminal S2 (RGB), the switching elements SW2R, SW2G, and SW2B, and thesource signal lines S1-R, S1-Q and S1-B are similarly connected.

The switching elements SW1R, SW1G, SW1B, SW2R, SW2G and SW2B can beformed of, for example, n-channel transistors. One of a source and adrain of the n-channel transistor is connected to a video input terminalS1 (RGB), the other of the source and the drain thereof is connected toa video input terminal S1 (RGB), and a gate thereof is connected to acontrol signal line R, thereby a function as a switching element can berealized. By using an n-channel transistor as the switching element, anamorphous semiconductor can be easily used, which is advantageous incost reduction and enlargement of the size. In addition to theaforementioned switches, a general analog switch configured with ann-channel transistor and a p-channel transistor connected in parallel orany element or circuit which can control on and off may be used.

FIG. 47 shows a timing chart in the case of writing a video signal tothe pixels 211 of the n-th row and the (n+1)th row. As described above,a period when a video signal is written to the n-th row (hereinafteralso referred to as one gate selection period) is divided into threeperiods. Video signals S1-Rn, S1-Gn, and S1-Bn are sequentially inputtedfrom an external circuit to the video signal input terminal S1 (RGB). Bycontrolling on/off of the switching element in accordance with thechanges of the video signals, video signals can be outputted to theaforementioned three source signal lines by one video signal inputterminal. As a result, the number of video signal input terminals can bereduced.

The driving method shown in FIG. 46 is an effective method for a displaydevice in which a gate driver configured with transistors and pixelswhich are formed of an amorphous semiconductor are formed over the samesubstrate. In the case of a display device in which only a pixel of anm-th row and an n-th column, source signal lines, and gate signal linesare formed, it requires at least m×n terminals to be connected to anexternal circuit. In the case of forming a gate driver and pixels overthe same substrate, a terminal for inputting a control signal, aterminal for a power source for driving the gate driver, and n inputterminals for n rows are required as input terminals. That is,approximately n input terminals are required. Here, as shown in FIG. 46,the scale of an external circuit can be reduced when the n terminals canbe reduced to (⅓) n terminals.

An operation of the circuit shown in FIG. 21 is described. As describedabove, a video signal can be written to the pixel 211 of a row selectedby the gate driver 212. The written video signal determines how muchlight the pixel 211 emits or transmits. After the selection by the gatedriver 212 is terminated, luminance or transmittance is held by holdingthe video signal by using a capacitor or capacitance of a displayelement until next selection is carried out. In this manner, activematrix drive can be realized.

Description is made with reference to FIG. 49 of a configuration exampleof a display device in which gate drivers are provided to be opposed toeach other as shown in the configuration examples of the display deviceshown in FIGS. 21, 22, and 46. Although not shown in FIG. 49, a sourcesignal line and the pixel 211 are provided.

As shown in FIG. 49, the gate drivers 212 are gate drivers which outputgate signals at the same timing, and outputs of each other are connectedin the same row. These gate drivers 212 can be similar to the gatedriver 212 shown in FIGS. 21 and 22.

As shown in FIG. 49, a driving method to drive one gate signal line bythe gate drivers 212 provided to oppose to each other is advantageous inthe case of forming the gate driver 212 using a transistor formed of anamorphous semiconductor regardless of the configuration of the gatedriver 212. A transistor which is formed of an amorphous semiconductorand has low mobility of charge is quite inferior in capability to apolycrystal semiconductor and a single crystal semiconductor. However,such a transistor can be manufactured by an easy manufacturing processand is suitable for enlargement in the size. Therefore, a display devicein which a portion of an internal circuit, for example, a gate driver isprovided over the same substrate as the substrate where pixels areprovided has been developed. However, in the case of forming a gatedriver using a transistor formed of an amorphous semiconductor, atransistor with a wide channel width is required because of the lowcapability of the transistor. Therefore, an area for the gate driver isincreased, which leads to a difficulty in realizing a narrower frame andhigher resolution. In view of this, by driving one gate signal line bytwo gate drivers provided to oppose to each other, the gate signal linecan be normally scanned even with low current capability.

As shown in FIG. 49, the aforementioned gate driver is not required touse the shift register circuit described in Embodiment Modes 1 to 4. Inparticular, the aforementioned gate driver is advantageous for a displaydevice in which a gate driver is integrated, which is formed by using atransistor formed of an amorphous semiconductor with a low capability.

Hereinafter described are some configuration examples of the pixels 211shown in FIGS. 21, 22, and 46.

Description is made with reference to FIG. 23 of a configuration exampleof the pixel 211 using liquid crystal elements.

The pixel 211 of FIG. 23 is configured with a transistor 231, acapacitor 232 having two electrodes, a liquid crystal element 233 havingtwo electrodes, a counter electrode 234 as the other electrode of theliquid crystal element 233, a source signal line, a gate signal line,and a common line as the other electrode of the capacitor 232. Thesource signal line and the gate signal line are similar to those shownin FIGS. 21, 22, and 46. The source signal line transmits an analogsignal voltage as a video signal.

The transistor 231 is an n-channel transistor which operates as aswitch. The transistor 231 is turned on when a potential of the gatesignal line is High, and turned off when the potential of the gatesignal line is Low. When the transistor 231 is turned on, the sourcesignal line and one electrode of the liquid crystal element 233, and oneelectrode of the capacitor 232 are electrically connected, thereby avideo signal transmitted from the source signal line is transmitted toone electrode of the liquid crystal element 233 and one electrode of thecapacitor 232 as it is. When the transistor 231 is turned off, thesource signal line and one electrode of the liquid crystal element 233,and one electrode of the capacitor 232 are electrically disconnected,thereby no charge is supplied or moved to one electrode of the capacitor232 and one electrode of the liquid crystal element 233.

The capacitor 232 is a capacitor for holding a video signal transmittedfrom the source signal line through the transistor 231 which is turnedon. The other electrode of the capacitor 232 is connected to the commonline which has a constant potential, a potential applied to oneelectrode of the capacitor 232 can be held for a certain period.Further, the other electrode of the capacitor 232 may be connectedanywhere as long as it has a constant potential in operation. Forexample, the other electrode of the capacitor 232 is preferablyconnected to a gate signal line of a preceding row. The gate signal lineof the preceding row has just been scanned; therefore, the gate signallines of almost all rows are Low and have a constant potential in thescan period. Thus, the gate signal line of the preceding row can be usedinstead of the common line.

The other electrode of the liquid crystal element 233 is connected tothe counter electrode 234 having a constant potential. The liquidcrystal element 233 is a liquid crystal element of which lighttransmittance changes depending on a potential difference between oneelectrode and the counter electrode 234. A potential of one electrode ofthe liquid crystal element 233 is determined by a video signaltransmitted through the source signal line and the transistor 231;therefore, the transmittance of the liquid crystal element 233 isdetermined by the potential of the video signal. In the case of adisplay device using the liquid crystal element 233, a backlight can beused, a reflective electrode can be used, or a backlight and areflective electrode can both be used. The liquid crystal element 233has a capacitive component. Therefore, when the liquid crystal element233 has a sufficient capacitive component for holding a video signal,the capacitor 232 and the common line are not required to be provided.

Description is made with reference to FIG. 38 of a configuration exampleof the pixel 211 using a light emitting element.

The pixel 211 shown in FIG. 38 is configured with a transistor 241, atransistor 242, a capacitor 243 having two electrodes, a light emittingelement 244 having two electrodes, a counter electrode 245 as the otherelectrode of the light emitting element 244, a power source line, asource signal line, and a gate signal line. The source signal line andthe gate signal line are similar to those shown in FIGS. 21, 22, and 46.The source signal line transmits an analog signal voltage or a 1-bitdigital signal voltage as a video signal.

The transistor 241 is an n-channel transistor which operates as aswitch. The transistor 241 is turned on when a potential of the gatesignal line is High, and turned off when the potential of the gatesignal line is Low. When the transistor 241 is turned on, the sourcesignal line, a gate of the transistor 242, and one electrode of thecapacitor 243 are electrically connected, thereby a video signaltransmitted from the source signal line is transmitted to the gate ofthe transistor 242 and one electrode of the capacitor 243 as it is. Whenthe transistor 241 is turned off, the source signal line, the gate ofthe transistor 242, and one electrode of the capacitor 243 areelectrically disconnected, thereby no charge is supplied or moved to thegate of the transistor 242 and one electrode of the capacitor 243.

The transistor 242 is an n-channel driving transistor which operates ina saturation region and a linear region. When the transistor 242operates in a saturation region, a current flowing therethrough isdetermined by a potential applied to a gate thereof, whereas when thetransistor 242 operates in a linear region, the transistor 242 is turnedon or off by a potential applied to the gate thereof. The power sourceline has a constant potential which is higher than that of the counterelectrode 245. Therefore, a source of the transistor 242 is connected tothe other electrode of the capacitor 243 and a drain thereof isconnected to the power source line.

The capacitor 243 is a capacitor for holding a video signal transmittedfrom the source signal line through the transistor 241 which is turnedon. One electrode of the capacitor 243 is connected to the gate of thetransistor 242 and the other electrode thereof is connected to thesource of the transistor 242. That is, the capacitor 243 holds apotential difference between the gate and the source of the transistor242. Therefore, when a source potential of the transistor 242 changes, agate potential of the transistor 242 changes as well by capacitivecoupling. The other electrode of the capacitor 243 is connected to thesource of the transistor 242 because the source potential thereofchanges depending on a current supplied to the light emitting element244 which is described later. That is, if a video signal writing period(a period when the transistor 241 is on) is terminated with a potentialof one electrode of the light emitting element 244 in a transient state,the source potential of the transistor 242 changes and a gate-sourcepotential changes, which results in changing a current value. If apotential of one electrode of the light emitting element 244 can be setin a steady state in the video signal writing period, the otherelectrode of the capacitor 243 may be connected to the power sourceline, a gate signal line of a preceding row, or anywhere having aconstant potential.

The luminance of the light emitting element 244 changes in proportion toa current supplied thereto. That is, the luminance is determined inproportion to a current value determined by the transistor 242. Theother electrode of the light emitting element 244 is connected to thecounter electrode 245. It is preferable that the counter electrode 245have a constant potential; however, the potential may be changed forcompensating the change in characteristics of the transistor 242.

Description is made with reference to FIG. 39 of a configuration exampleof the pixel 211 using a light emitting element and a pixel circuit forcompensating the change in characteristics of a driving transistor.

The pixel 211 shown in FIG. 39 is configured with a transistor 251, atransistor 252, a transistor 253, a capacitor 254 having two electrodes,a light emitting element 244 having two electrodes, a counter electrode245 as the other electrode of the light emitting element 244, a powersource line, a source signal line, and a gate signal line. The sourcesignal line and the gate signal line are similar to those shown in FIGS.21, 22, and 46. The light emitting element 244 and the counter electrode245 are similar to those in FIG. 38. The source signal line transmits ananalog signal current as a video signal.

The transistor 251 is an n-channel transistor which operates as aswitch. The transistor 251 is turned on when a potential of the gatesignal line is High and off when the potential of the gate signal lineis Low. When the transistor 251 is turned on, the source signal line, asource of the transistor 252, one electrode of the capacitor 254, andone electrode of the light emitting element 244 are electricallyconnected, thereby a video signal is transmitted from the source signalline. When the transistor 251 is turned off, the source signal line, thesource of the transistor 252, one electrode of the capacitor 254, andone electrode of the light emitting element 244 are electricallydisconnected, thereby a video signal is not transmitted.

The transistor 252 is an n-channel transistor which operates as aswitch. The transistor 252 is turned on when a potential of the gatesignal line is High and off when the potential of the gate signal lineis Low. When the transistor 252 is turned on, the power source line anda gate of a transistor 253 are electrically connected, thereby thetransistor 253 is diode-connected. When the transistor 252 is turnedoff, the power source line and the gate of the transistor 253 aredisconnected, thereby no charge is supplied or moved to the gate of thetransistor 252.

The transistor 253 is an n-channel transistor which operates in asaturation region. The transistor 253 is a driving transistor of whichgate voltage is determined by a current flowing therethrough. In awriting period when a current as a video signal is inputted from thesource signal line through the transistors 251 and 252 which are turnedon by the gate signal line having a High potential, the transistor 253is diode-connected. A source of the transistor 253 is connected to oneelectrode of the light emitting element and a drain thereof is connectedto the power source line so that a current as a video signal flows fromthe power source line side. Here, as in the video signal writing period,it is preferable that a potential of the power source line be apotential which makes a source potential of the transistor 253 be equalto or lower than the sum of a potential of a counter electrode 256 and athreshold voltage of the light emitting element 244. If the sourcepotential of the transistor 253 is higher than the sum of the potentialof the counter electrode 256 and the threshold voltage of the lightemitting element 244, a current large enough for the light emittingelement 244 to emit light is supplied and the light emitting element 244emits light. Moreover, a video signal cannot be written accurately,which degrades display quality. In this manner, when a video signal iswritten, the video signal is held in the capacitor 254 which isconnected between the gate and the source of the transistor 253 inaccordance with the video signal. As the transistor 253 operates in asaturation region, a constant current flows therethrough if a potentialdifference between the source and drain potentials is held. In thismanner, a video signal is written and the transistors 251 and 252 areturned off, thereby the gate of the transistor 253 becomes a floatingstate. When a potential of the power source line is raised in thisstate, a current corresponding to the video signal starts flowing fromthe power source line through the transistor 253 to the light emittingelement 244. When the current starts flowing, a potential correspondingto the flowing current is supplied to one electrode of the lightemitting element 244, thereby a potential thereof gradually rises. As aresult, a source potential of the transistor 253 changes and a gatepotential of the transistor 253 rises at the same time since thecapacitor 254 holds a potential difference between the gate and thesource of the transistor 253. That is, the potential difference betweenthe gate and the source of the transistor 253 does not change even whenthe potential of the power source line becomes high and a current startsflowing to the light emitting element 244. Therefore, a current valuecorresponding to the video signal can be supplied to the light emittingelement 244.

The capacitor 254 is a capacitor for holding a potential differencebetween the gate and the source of the transistor 253. As describedabove, one electrode of the capacitor 254 is connected to the source ofthe transistor 253 and one electrode of the light emitting element 244,while the other electrode thereof is connected to the gate of thetransistor 253.

As described above, the power source line has a low potential in a videosignal writing period and a high potential when the writing period isterminated. That is, the power source line has a potential of a binaryvalue. The shift register circuit described in Embodiment Modes 1 to 4may be used to drive this power source line. This shift register circuithas a configuration to sequentially output a High signal. However, byusing an inverter circuit which inverts between High and Low, a functionas the power source line can be achieved.

Description is made with reference to FIG. 40 of a configuration exampleof the pixel 211 using a light emitting element and a pixel circuit forcompensating the change in characteristics of a driving transistor.

The pixel 211 shown in FIG. 40 is configured with a transistor 261, atransistor 262, a transistor 263, a transistor 264, a capacitor 265having two electrodes, a constant potential line 266 as the otherelectrode of the capacitor 265, the light emitting element 244 havingtwo electrodes, the counter electrode 245 as the other electrode of thelight emitting element 244, the power source line, the source signalline, and the gate signal line. The source signal line and the gatesignal line are similar to those described in FIGS. 21, 22, and 46. Thelight emitting element 244 and the counter electrode 245 are similar tothose shown in FIG. 38. The source signal line transmits an analogsignal current as a video signal.

The transistors 261 and 262 are n-channel transistors which operates asswitches. The transistors 261 and 262 are turned on when a potential ofthe gate signal line is High and off when the potential of the gatesignal line is Low. When the transistors 261 and 262 are turned on, thesource signal line and a gate of the transistor 263, a gate of thetransistor 264, and one electrode of the capacitor 265 are electricallyconnected, thereby the transistor 263 is diode-connected. A video signalis a current which flows from the source signal line. Sources of thetransistors 263 and 264 are connected to one electrode of the lightemitting element so that the power source line has a higher potentialthan one electrode of the light emitting element. A drain of thetransistors 263 is connected to the transistor 262 and a drain of thetransistor 264 is connected to the power source line.

The transistor 263 is an n-channel transistor which operates in asaturation region. The transistor 263 is a driving transistor of whichgate voltage is determined by a current flowing therethrough. When thegate signal line has a High potential and the transistors 261 and 262are turned on, the transistor 263 is diode-connected and a video signalis inputted from the source signal line. A gate potential of thetransistor 263 at that time corresponds to the video signal and thetransistors 263 and 264 have gates and sources in common; therefore, agate potential of the transistor 264 also corresponds to the videosignal. A potential of the gates of the transistors 263 and 264 at thattime is held at one electrode of the capacitor 265. In this manner, thegate signal line has a Low potential, thereby the transistors 261 and262 are turned off. Then, the gate potential of the transistors 263 and264 is held in the capacitor 265. The drain of the transistor 263becomes a floating state; therefore, a current does not flow through thetransistor 263 to the light emitting element 244.

The constant potential line 266 as the other electrode of the capacitor265 may be the power source line or a gate signal line of a precedingrow. Alternatively, one electrode of the light emitting element 244 maybe used. In this manner, a current corresponding to a video signal canbe supplied to the light emitting element without changing a potentialdifference between the gate and the source of the transistor 264 evenwhen a potential of one electrode of the light emitting element 244changes.

Embodiment Mode 7

In this embodiment mode, description is made of a layout example of theshift register circuit described in Embodiment Modes 1 to 4.

Description is made with reference to FIG. 44 of a configuration exampleof the case where the shift register circuit described in EmbodimentMode 1 is formed of a bottom gate type transistor. FIG. 44 shows aconfiguration example of the shift register circuit described inEmbodiment Mode 1; however, the invention is not limited to this andthis embodiment mode can be applied to the shift register circuitdescribed in Embodiment Modes 2 to 4 as well. In addition, thisembodiment mode can be applied to a shift register circuit other thanthose described in Embodiment Modes 1 to 4.

FIG. 44 includes a transistor 31, a transistor 32, a transistor 41, atransistor 42, three control signal lines for transmitting controlsignals of CK1, CK2, and CK3, a power source line having a potential ofthe positive power source VDD, and two power source lines each having apotential of the negative power source VSS. The control signal line fortransmitting CK1 is referred to as a control signal line CK1, thecontrol signal line for transmitting CK2 is referred to as a controlsignal line CK2, the control signal line for transmitting CK3 isreferred to as a control signal line CK3, the power source line having apotential of the positive power source VDD is referred to as a powersource line VDD, and the power source line having a potential of thenegative power source VSS is referred to as a power source line VSS.

Description is made of some features of the configuration example of theshift register circuit shown in FIG. 44.

A feature of the shift register circuit is that the power source lineVDD and the power source line VSS are provided between OUT(1) as anoutput of the shift register circuit, and the control signal lines CK1,CK2, and CK3. The control signal lines CK1, CK2, and CK3 which arecontrol signal lines for transmitting clock signals have constantlychanging potentials. Therefore, when parasitic capacitance is generatedbetween the control signal lines, a noise may occur due to a change inpotential of the control signal line. As OUT(1) corresponds to an inputof a shift register circuit of a following stage, the shift registercircuit easily malfunctions if a noise occurs in OUT(1). Therefore, byproviding the power source lines having constant potentials between thecontrol signal lines and OUT(1), an effect of the noise generated by thecontrol signal lines on the shift register circuit can be reduced.

A feature of the shift register circuit is that the power source lineVDD, the power source line VSS, and a transistor are provided between ametal wiring layer for connecting the output of the transistor 32 andOUT(1) and the control signal lines CK1, CK2, and CK3. As describedabove, if a noise occurs in the metal wiring layer for connecting theoutput of the transistor 32 and OUT(1), a malfunction of the shiftregister circuit may occur. Moreover, depending on the arrangement ofthe transistors, a long wire is required to be prepared. Therefore, byproviding a power source line and a transistor between the controlsignal lines, a noise can be prevented.

A feature of the shift register circuit is that the transistor 32 whichperforms a boot strap operation is formed of a U-shaped transistor. Thetransistor 32 is a transistor for supplying the positive power sourceVDD of the output; therefore, a high current capability is required. Byusing a U-shaped transistor, a channel width can be set wide.

One of the source or the drain of the transistors 41 and 42 is used incommon. As a result, as an area for the shift register circuit can besmaller, it is advantageous in that a display device with higherresolution and a narrower frame can be provided.

A feature of the shift register circuit is that the power source lineand the control signal line have the same widths. Normally, a largeinstantaneous current flows through the power source line; therefore, awidth thereof is formed wide to reduce wiring resistance. In thismanner, a malfunction caused by a voltage drop due to the instantaneouscurrent is prevented. However, the control signal line is used foroutputting the potential of the positive power source VDD in theinvention; therefore, a large instantaneous current also flows throughthe control signal line. In view of this, it is preferable that thewidth of the control signal line is wide. If the width of the controlsignal line is as narrow as before, the control signal line cannot holdthe potential due to a voltage drop caused by a large instantaneouscurrent, which leads to a malfunction of the shift register circuit. Inview of this, it is preferable that the control signal line and thepower source line have the same widths. Further, as a small currentflows through the power source line in the shift register circuit of theinvention, the control signal line may have a wider width than the powersource line.

Description is made with reference to FIG. 45 of another configurationexample of the case where the shift register circuit described inEmbodiment Mode 1 is formed of a bottom gate type transistor. FIG. 45shows a configuration example of the shift register circuit described inEmbodiment Mode 1; however, the invention is not limited to this andthis embodiment mode can be applied to the shift register circuitsdescribed in Embodiment Modes 2 to 4 as well. Further, this embodimentmode can be applied to a shift register circuit except for thosedescribed in Embodiment Modes 1 to 4.

The circuit shown in FIG. 45 is configured with the transistor 31, thetransistor 32, the transistor 41, the transistor 42, three controlsignal lines for transmitting controls signals of CK1, CK2, and CK3, andtwo power source lines which are a power source line having a potentialof the positive power source VDD and a power source line having apotential of the negative power source VSS. The control signal line fortransmitting CK1 is referred to as a control signal line CK1, thecontrol signal line for transmitting CK2 is referred to as a controlsignal line CK2, the control signal line for transmitting CK3 isreferred to as a control signal line CK3, the power source line having apotential of the positive power source VDD is referred to as a powersource line VDD, and the power source line having a potential of thenegative power source VSS is referred to as a power source line VSS.

Description is made of some features of the configuration example of theshift register circuit shown in FIG. 45.

A feature of the shift register circuit is that a transistorconstituting the shift register circuit is provided so as to besandwiched by the power source lines having constant potentials. When aboot strap operation is employed, a noise is required to be reducedsince a node in a floating state exists. That is, by sandwiching thetransistor with the power source lines having constant potentials, anoise caused by the control signal line or other circuits can bereduced.

Embodiment 1

In this embodiment, a structure example of a pixel is described. FIGS.24A and 24B are cross sectional views each showing a pixel in the panelof the invention. They show an example in which a transistor is used asa switching element arranged in the pixel, and a light emitting elementis used as a display medium arranged in the pixel.

In FIGS. 24A and 24B, a reference numeral 2400 denotes a substrate, 2401denotes a base film, each of 2402 and 2412 denotes a semiconductorlayer, 2403 denotes a first insulating film, 2404 denotes a gateelectrode, 2414 denotes an electrode, 2405 denotes a second insulatingfilm, 2406 denotes an electrode which can function as a source electrodeor a drain electrode, 2407 denotes a first electrode, 2408 denotes athird insulating film, 2409 denotes a light emitting layer, 2417 denotesa second electrode, 2410 denotes a transistor, 2415 denotes a lightemitting element, and 2411 denotes a capacitor. In FIGS. 24A and 24B,the transistor 2410 and the capacitor 2411 are shown as representativesof elements forming a pixel. A structure of FIG. 24A is described.

The substrate 2400 can be a glass substrate such as a bariumborosilicate glass substrate or an alumino borosilicate glass substrate,a quartz substrate, a ceramic substrate, or the like. Alternatively, thesubstrate 2400 may be a metal substrate including stainless steel or asemiconductor substrate each having a surface over which an insulatingfilm is formed. Alternatively, the substrate 2400 may be formed of aflexible synthetic resin such as plastic. The surface of the substrate2400 may be planarized in advance by polishing such as CMP.

The base film 2401 can be an insulating film such as silicon oxide,silicon nitride, or silicon nitride oxide. The base film 2401 canprevent an alkaline earth metal or an alkali metal such as Na includedin the substrate 2400 from diffusing into a semiconductor layer 2402 andfrom causing an adverse effect on the characteristic of the transistor2410. Although in FIGS. 24A and 24B, the base film 2401 is formed of asingle layer, it may be formed of two or more layers. Note that in thecase where diffusion of impurities is not a big problem like in the caseof using a quartz substrate, the base film 2401 is not always requiredto be provided.

As the semiconductor layers 2402 and 2412, a patterned crystallinesemiconductor film and amorphous semiconductor film can be used. Acrystalline semiconductor film can be obtained by crystallizing anamorphous semiconductor film. As a crystallization method, lasercrystallization, thermal crystallization using RTA or an annealingfurnace, thermal crystallization using a metal element for promotingcrystallization, or the like can be used. The semiconductor layer 2402includes a channel forming region and a pair of impurity regions towhich an impurity element imparting a conductivity type is added. Notethat another impurity region to which an impurity element is added at alow concentration may be provided between the channel forming region andthe pair of impurity regions. Accordingly, the semiconductor layer 2412can have a structure where an impurity element imparting a conductivitytype is added to the whole semiconductor layer 2412.

The first insulating film 2403 can be formed of a single layer orstacked layers of a plurality of films by using silicon oxide, siliconnitride, silicon nitride oxide, or the like. It is to be noted that alayer containing hydrogen is used as the first insulating film 2403, andthe semiconductor layer 2402 may be hydrogenated.

The gate electrode 2404 and the electrode 2414 are formed of a singlelayer or stacked layers of elements selected from Ta, W, Ti, Mo, Al, Cu,Cr, and Nd or an alloy or a compound containing such elements.

The transistor 2410 includes the semiconductor layer 2402, the gateelectrode 2404, and the first insulating film 2403 between thesemiconductor layer 2402 and the gate electrode 2404. Although in FIGS.24A and 24B, only the transistor 2410 connected to the first electrode2407 of the light emitting element 2415 is shown as a transistorconstituting a pixel, a pixel may include a plurality of transistors.Further, although in this embodiment, the transistor 2410 is shown as atop gate transistor, it may also be a bottom gate transistor having agate electrode below the semiconductor layer, or a dual gate transistorhaving gate electrodes above and below the semiconductor layer.

The capacitor 2411 includes the first insulating film 2403 as adielectric, and the semiconductor layer 2412 and the electrode 2414 as apair of electrodes that faces each other with the first insulating film2403 interposed therebetween. FIGS. 24A and 24B show an example in whichone of the pair of electrodes of the capacitor included in a pixel isthe semiconductor layer 2412 formed at the same time as thesemiconductor layer 2402 of the transistor 2410, and the other electrodeis the electrode 2414 formed at the same time as the gate electrode 2404of the transistor 2410. However, the invention is not limited to this.

The second insulating film 2405 can be formed of a single layer orstacked layers of an inorganic insulating film or an organic insulatingfilm. As an inorganic insulating film, a silicon oxide film formed byCVD, a silicon oxide film applied by SOG (Spin On Glass), or the likecan be used. As an organic insulating film, a film of polyimide,polyamide, BCB (benzocyclobutene), acrylic, a positive photosensitiveorganic resin, a negative photosensitive organic resin, or the like canbe used.

Further, as the second insulating film 2405, a material having askeleton of a bond of silicon (Si) and oxygen (O) can be used. As asubstituent of this material, an organic group containing at leasthydrogen (for example, alkyl group or aromatic hydrocarbon) is used.Alternatively, a fluoro group, or both an organic group containing atleast hydrogen and a fluoro group may be used as a substituent.

A surface of the second insulating film 2405 may be processed with highdensity plasma to be nitrided. The high density plasma is generated byusing a microwave with a high frequency, for example, 2.45 GHz. It is tobe noted that high density plasma with an electron density of 1×10¹¹ to1×10¹³ cm⁻³ and an electron temperature of 0.2 to 2.0 eV (morepreferably, 0.5 to 1.5 eV) is used. Since the high density plasma with afeature of the low electron temperature has low kinetic energy of activespecies as mentioned above, a film having less defects can be formedwith less plasma damage as compared to the conventional plasmatreatment. In high density plasma treatment, a temperature of thesubstrate 2400 is set to be 350 to 450° C. Further, in an apparatus forgenerating high density plasma, a distance between an antenna forgenerating a microwave and the substrate 2400 is set to be 20 to 80 mm(preferably, 20 to 60 mm).

In an atmosphere of nitrogen (N₂) and a rare gas (containing at leastone of He, Ne, Ar, Kr, and Xe), or an atmosphere of nitrogen, hydrogen(H₂), and a rare gas, or an atmosphere of ammonia (NH₃) and a rare gas,the aforementioned high density plasma treatment is performed to nitridethe surface of the second insulating film 2405. The surface of thesecond insulating film 2405 formed by the nitridation treatment with thehigh density plasma is mixed with H or an element such as He, Ne, Ar,Kr, or Xe. For example, a silicon oxide film or a silicon oxynitridefilm is used as the second insulating film 2405 and is subjected to thehigh density plasma treatment to form a silicon nitride film. Byutilizing hydrogen contained in the thus formed silicon nitride film,the semiconductor layer 2402 of the transistor 2410 may be hydrogenated.Note that the hydrogenation treatment may be combined with theaforementioned hydrogenation treatment using hydrogen contained in thefirst insulating film 2403. Note that an insulating film may be formedover a nitride film formed by the aforementioned high density plasmatreatment so as to be used as the second insulating film 2405.

The electrode 2406 is formed of a single layer or stacked layers of anelement selected from Al, Ni, C, W, Mo, Ti, Pt, Cu, Ta, Au, and Mn, oran alloy containing such elements.

One or both of the first electrode 2407 and the second electrode 2417can be a light-transmissive electrode. As a light-transmissiveelectrode, indium oxide containing tungsten oxide (IWO), indium zincoxide containing tungsten oxide (IWZO), indium oxide containing titaniumoxide (ITO), indium tin oxide containing titanium oxide (ITTiO), or thelike may be used. Alternatively, it is needless to say that indium tinoxide (ITO), indium zinc oxide (IZO), indium tin oxide to which siliconoxide is added (ITSO), or the like may be used.

The light emitting layer 2409 is preferably formed of a plurality oflayers which has a different function, such as a holeinjecting/transporting layer, a light emitting layer, and an electroninjecting/transporting layer.

A hole injecting/transporting layer is preferably formed of a compoundmaterial including an organic compound material with a hole transportingproperty and an inorganic compound material with an electron acceptingproperty with respect to the organic compound material. This structuregenerates a lot of hole carriers in an organic compound which originallyhas almost no inherent carriers so that an extremely excellent holeinjecting/transporting property can be obtained. Accordingly, a drivingvoltage can be set lower than a conventional driving voltage. Further,since the hole injecting/transporting layer can be made thick withoutraising a driving voltage, a short circuit of the light emitting elementdue to dust or the like can be suppressed.

As an organic compound material with a hole transporting property,4,4′,4″-tris[N-(3-methylphenyl)-N-phenylamino]-triphenylamine(abbreviated to MTDATA), 1,3,5-tris[N,N-di(m-tolyl)amino]benzene(abbreviated to m-MTDAB),N,N′-diphenyl-N,N′-bis(3-methylphenyl)-1,1′-biphenyl-4,4′-diamine(abbreviated to TPD), 4,4′-bis[N-(1-naphthyl)-N-phenylamino]biphenyl(abbreviated to NPB) or the like is given as an example. However, theorganic compound material with a hole transporting property is notlimited to the example.

As an inorganic compound material with an electron accepting property,titanium oxide, zirconium oxide, vanadium oxide, molybdenum oxide,tungsten oxide, rhenium oxide, ruthenium oxide, and zinc oxide, or thelike is given as an example. In particular, vanadium oxide, molybdenumoxide, tungsten oxide, and rhenium oxide are preferred since theseoxides can be used easily for vacuum deposition.

An electron injecting/transporting layer is formed using an organiccompound material with an electron transporting property. Specifically,tris(8-quinolinolato)aluminum (abbreviated to Alq₃),tris(4-methyl-8-quinolinolato)aluminum (abbreviated to Almq₃), or thelike is given as an example. However, the organic compound material withan electron transporting property is not limited to the example.

As a light emitting layer, the following compound can be given as anexample: 9,10-di(2-naphthyl)anthracene (abbreviated to DNA),9,10-di(2-naphthyl)-2-tert-butylanthracene (abbreviated to t-BuDNA),4,4′-bis(2,2-diphenylvinyl)biphenyl (abbreviated to DPVBi), coumarin 30,coumarin 6, coumarin 545, coumarin 545T, perylene, rubrene,periflanthene, 2,5,8,11-tetra(tert-butyl)perylene (abbreviated to TBP),9,10-diphenylanthracene (abbreviated to DPA), 5,12-diphenyltetracene,4-(dicyanomethylene)-2-methyl-[p-(dimethylamino)styryl]-4H-pyran(abbreviated to DCM1),4-(dicyanomethylene)-2-methyl-6-[2-(julolidine-9-yl)ethenyl]-4H-pyran(abbreviated to DCM2), and4-(dicyanomethylene)-2,6-bis[p-(dimethylamino)styryl]-4H-pyran(abbreviated to BisDCM), or the like. Alternatively, a compound capableof emitting phosphorescence such asbis[2-(4′,6′-difluorophenyl)pyridinato-N,C^(2′)]iridium(picolinate)(abbreviated to Flrpic),bis{2-[3′,5′-bis(trifluoromethyl)phenyl]pyridinato-N,C^(2′)}iridium(picolinate)(abbreviated to Ir(CF₃ppy)₂(pic)),tris(2-phenylpyridinato-N,C^(2′))iridium (abbreviated to Ir(ppy)₃),bis(2-phenylpyridinato-N,C²)iridium(acetylacetonate) (abbreviated toIr(ppy)₂(acac)),bis[2-(2′-thienyl)pyridinato-N,C^(3′)]iridium(acetylacetonate)(abbreviated to Ir(thp)₂(acac)),bis(2-phenylquinolinato-N,C^(2′))iridium(acetylacetonate) (abbreviatedto Ir(pq)₂(acac)), orbis[2-(2′-benzothienyl)pyridinato-N,C^(3′)]iridium(acetylacetonate)(abbreviated to Ir(btp)₂(acac)) can be used.

Besides, as a high molecular electroluminescent material that can beused to form the light emitting layer, a polyparaphenylene vinylenebased material, a polyparaphenylene based material, a polythiophenebased material, or a polyfluorene based material can be given as anexample.

In any case, the structure of the light emitting layer can vary.Therefore, instead of providing a specific hole or electroninjecting/transporting layer or light emitting layer, modifications ofthe structure such as providing an electrode layer in order to be usedfor the hole or electron injecting/transporting layer or the lightemitting layer, or providing a dispersed light emitting material can beallowed as far as an object as the light emitting element can beachieved.

The other of the first electrode 2407 and the second electrode 2417 maybe formed of a non-light transmissive material. For example, an alkalinemetal such as Li or Cs, an alkali earth metal such as Mg, Ca, or Sr, analloy containing such metals (Mg:Ag, Al:Li, Mg:In, or the like), acompound of such metals (CaF₂ or CaN), or a rare earth metal such as Ybor Er can be used.

The third insulating film 2408 can be formed using the same material asthe second insulating film 2405. The third insulating film 2408 isformed on the periphery of the first electrode 2407 so as to cover anend portion of the first electrode 2407, and has a function ofseparating the light emitting layer 2409 between adjacent pixels.

The light emitting layer 2409 is formed of a single layer or a pluralityof layers. In the case where it is formed of a plurality of layers,these layers can be categorized into a hole injecting layer, a holetransporting layer, a light emitting layer, an electron transportinglayer, an electron injecting layer, and the like in terms of a carriertransporting property. Note that a boundary between layers is not alwaysrequired to be clear, and there is a case where materials constitutingadjacent layers are mixed with each other so that an interface isunclear. An organic material or an inorganic material can be used foreach layer. As an organic material, any of a high molecular organicmaterial, a medium molecular organic material, and a low molecularorganic material can be used.

The light emitting element 2415 is formed of the light emitting layer2409, and the first electrode 2407 and the second electrode 2417 whichinterpose the light emitting layer 2409 therebetween. One of the firstelectrode 2407 and the second electrode 2417 corresponds to an anode,and the other corresponds to a cathode. When a forward bias voltagehigher than a threshold voltage is applied between the anode and thecathode, a current flows from the anode to the cathode so that the lightemitting element 2415 emits light.

Description is made of a structure of FIG. 24B. Note that the samereference numeral is used for a common portion in FIGS. 24A and 24B, andthe description is omitted. FIG. 24B shows a structure in which aninsulating film 2418 is sandwiched between the second insulating film2405 and the third insulating film 2408 in FIG. 24A. The secondelectrode 2416 and the first electrode 2406 are connected in a contacthole formed in the insulating film 2418.

The insulating film 2418 can have the same structure as the secondinsulating film 2405. The second electrode 2416 can have the samestructure as the first electrode 2406.

Embodiment 2

In this embodiment, description is made of the case of using anamorphous silicon (a-Si:H) film as a semiconductor layer of atransistor. FIGS. 28A and 28B each show a case of a top gate transistor,and FIGS. 29A to 30B each show a case of a bottom gate transistor.

FIG. 28A shows a cross sectional view of a top gate transistor whichuses amorphous silicon for the semiconductor layer. A base film 2802 isformed over a substrate 2801. Further, a pixel electrode 2803 is formedover the base film 2802. In addition, a first electrode 2804 is formedin the same layer with the same material as the pixel electrode 2803.

As the substrate, a glass substrate, a quartz substrate, a ceramicsubstrate, or the like can be used. The base film 2802 can be formedusing a single layer of aluminum nitride, silicon oxide, siliconoxynitride, or the like or stacked layers thereof.

Wires 2805 and 2806 are formed over the base film 2802, and an endportion of the pixel electrode 2803 is covered with the wire 2805.N-type semiconductor layers 2807 and 2808 each having N-typeconductivity are formed over the wires 2805 and 2806 respectively. Inaddition, a semiconductor layer 2809 is formed between the wires 2805and 2806 and over the base film 2802, which is partially extended so asto cover the N-type semiconductor layers 2807 and 2808. Note that thissemiconductor layer is formed of an amorphous semiconductor film such asan amorphous silicon (a-Si:H) film or a microcrystalline semiconductor(μ-Si:H) film. Then, a gate insulating film 2810 is formed over thesemiconductor layer 2809, and an insulating film 2811 is formed in thesame layer with the same material as the gate insulating film 2810, andalso over the first electrode 2804. Note that as the gate insulatingfilm 2810, a silicon oxide film, a silicon nitride film, or the like isused.

A gate electrode 2812 is formed over the gate insulating film 2810. Inaddition, a second electrode 2813 is formed in the same layer with thesame material as the gate electrode, and over the first electrode 2804with the insulating film 2811 interposed therebetween. A capacitor 2819corresponds to a region where the insulating film 2811 is interposedbetween the first electrode 2804 and the second electrode 2813. Aninterlayer insulating film 2814 is formed so as to cover end portions ofthe pixel electrode 2803, the driving transistor 2818, and the capacitor2819.

A layer 2815 including an organic compound and a counter electrode 2816are formed over the interlayer insulating film 2814 and the pixelelectrode 2803 located in an opening portion of the interlayerinsulating film 2814. Thus, a light emitting element 2817 corresponds toa region where the layer 2815 including an organic compound isinterposed between the pixel electrode 2803 and the counter electrode2816.

The first electrode 2804 shown in FIG. 28A may be formed of a firstelectrode 2820 as shown in FIG. 28B. The first electrode 2820 is formedin the same layer with the same material as the wires 2805 and 2806.

FIGS. 29A and 29B are partial cross sectional views of a display panelhaving a bottom gate transistor which uses amorphous silicon as itssemiconductor layer. A gate electrode 2903 is formed over a substrate2901. Further, a first electrode 2904 is formed in the same layer withthe same material as the gate electrode 2903. A high melting point metalsuch as Ti, Cr, Mo, W, or Ta can be used for the gate electrode 2903.

A gate insulating film 2905 is formed so as to cover the gate electrode2903 and the first electrode 2904. As the gate insulating film 2905, asilicon oxide film, a silicon nitride film, or the like is used.

A semiconductor layer 2906 is formed over the gate insulating film 2905.In addition, a semiconductor layer 2907 is formed in the same layer withthe same material as the semiconductor layer 2906. As the substrate, aglass substrate, a quartz substrate, a ceramic substrate, or the likecan be used.

N-type semiconductor layers 2908 and 2909 having N-type conductivity areformed over the semiconductor layer 2906, and an N-type semiconductorlayer 2910 is formed over the semiconductor layer 2907. Wires 2911 and2912 are formed over the N-type semiconductor layers 2908 and 2909respectively, and a conductive layer 2913 is formed in the same layerwith the same material as the wires 2911 and 2912, over the N-typesemiconductor layer 2910.

A second electrode is formed of the semiconductor layer 2907, the N-typesemiconductor layer 2910, and the conductive layer 2913. Note that acapacitor 2920 having a structure where the gate insulating film 2905 isinterposed between the second electrode and the first electrode 2904 isformed.

One end portion of the wire 2911 is extended, and a pixel electrode 2914is formed so as to be in contact with an upper portion of the extendedwire 2911.

Then, an insulating layer 2915 is formed so as to cover an end portionof the pixel electrode 2914, a driving transistor 2919, and a capacitor2920. A layer 2916 including an organic compound and a counter electrode2917 are formed over the pixel electrode 2914 and the insulating layer2915. A light emitting element 2918 corresponds to a region where thelayer 2916 including an organic compound is interposed between the pixelelectrode 2914 and the counter electrode 2917.

The semiconductor layer 2907 and the N-type semiconductor layer 2910 tobe a part of the second electrode of the capacitor are not necessarilyrequired. That is, the second electrode may be the conductive layer2913, so that the capacitor may have such a structure that the gateinsulating film is interposed between the first electrode 2904 and theconductive layer 2913.

Note that the pixel electrode 2914 is formed before forming the wire2911 in FIG. 29A, thereby a capacitor 2920 shown in FIG. 29B can beobtained, which has a structure where the gate insulating film 2905 isinterposed between the first electrode 2904 and a second electrode 2921formed of the pixel electrode 2914.

Although FIGS. 29A and 29B show inverted staggered channel-etchedtransistors, a channel-protective transistor may be used. Description ofchannel-protective transistors is made with reference to FIGS. 30A and30B.

A channel-protective transistor shown in FIG. 30A is different from thechannel-etched driving transistor 2919 shown in FIG. 29A in that aninsulating layer 3001 functioning as an etching mask is provided overthe channel forming region in the semiconductor layer 2906. Other commonportions are denoted by the same reference numerals.

Similarly, a channel-protective transistor shown in FIG. 30B isdifferent from the channel-etched driving transistor 2919 shown in FIG.29B in that the insulating layer 3001 functioning as an etching mask isprovided over the channel forming region in the semiconductor layer2906. Other common portions are denoted by the same reference numerals.

By using an amorphous semiconductor film as a semiconductor layer(channel forming region, source region, drain region, or the like) of atransistor included in the pixel of this embodiment, the manufacturingcost can be reduced. For example, an amorphous semiconductor film can beapplied by using the pixel structure shown in FIGS. 6 and 7.

Structures of the transistors and capacitors to which the pixelstructure of this embodiment can be applied are not limited to thosedescribed above, and various structures of transistors and capacitorscan be used.

This embodiment can be implemented in free combination with Embodiment1.

Embodiment 3

In this embodiment, description is made of a manufacturing method of asemiconductor device using plasma treatment, as a method ofmanufacturing a semiconductor device including transistors, for example.

FIGS. 31A to 31C show structure examples of a semiconductor deviceincluding transistors. Note that FIG. 31B corresponds to a crosssectional view taken along a line a-b in FIG. 31A, whereas FIG. 31Ccorresponds to a cross sectional view taken along a line c-d in FIG.31A.

The semiconductor device shown in FIGS. 31A to 31C includessemiconductor films 4603 a and 4603 b provided over a substrate 4601with an insulating film 4602 interposed therebetween, gate electrodes4605 provided over the semiconductor films 4603 a and 4603 b with a gateinsulating layer 4604 interposed therebetween, insulating films 4606 and4607 provided so as to cover the gate electrodes 4605, and a conductivefilm 4608 provided over the insulating film 4607 and electricallyconnected to a source region or a drain region of the semiconductorfilms 4603 a and 4603 b. Although FIGS. 31A to 31C show a case ofproviding an n-channel transistor 4610 a which uses a part of thesemiconductor film 4603 a as a channel region, and a p-channeltransistor 4610 b which uses a part of the semiconductor film 4603 b asa channel region, the invention is not limited to such a structure. Forexample, although the n-channel transistor 4610 a is provided with LDDregions, whereas the p-channel transistor 4610 b is not provided withLDD regions in FIGS. 31A to 31C, such structures may be provided thatboth of the transistors are provided with LDD regions or neither of thetransistors is provided with LDD regions.

In this embodiment, the semiconductor device shown in FIGS. 31A to 31Cis manufactured by oxidizing or nitriding a semiconductor film or aninsulating film, that is, by performing plasma oxidation or nitridationtreatment to at least one layer among the substrate 4601, the insulatingfilm 4602, the semiconductor films 4603 a and 4603 b, the gateinsulating film 4604, the insulating film 4606, and the insulating film4607. In this manner, by oxidizing or nitriding a semiconductor film oran insulating film by plasma treatment, the surface of the semiconductorfilm or the insulating film can be modified, thereby a denser insulatingfilm can be formed, as compared to an insulating film formed by CVD orsputtering. Therefore, defects such as pin holes can be suppressed, andthus the characteristics and the like of the semiconductor device can beimproved.

In this embodiment, description is made of a manufacturing method of asemiconductor device by oxidizing or nitriding the semiconductor films4603 a and 4603 b or the gate insulating film 4604 shown in FIGS. 31A to31C by plasma treatment, with reference to the drawings.

Description is made of a case where island-shaped semiconductor filmsare each formed so as to have an edge portion with an almost rightangle.

First, the semiconductor films 4603 a and 4603 b with island shapes areformed over the substrate 4601 (FIG. 32A). The semiconductor films 4603a and 4603 b with island shapes can be provided by forming an amorphoussemiconductor film by sputtering, LPCVD, plasma CVD, or the like using amaterial containing silicon (Si) as a main component (for example,SixGe1-x) over the insulating film 4602 which is formed in advance overthe substrate 4601, and then crystallizing the amorphous semiconductorfilm, and further etching the semiconductor film selectively. Note thatthe crystallization of the amorphous semiconductor film can be performedby a crystallization method such as laser crystallization, thermalcrystallization using RTA or an annealing furnace, thermalcrystallization using metal elements which promote crystallization, or acombination of them. Note that in FIG. 32A, the semiconductor films 4603a and 4603 b with island shapes are each formed so as to have an edgeportion with an almost right angle (0=85 to 100°).

Subsequently, the semiconductor films 4603 a and 4603 b are oxidized ornitrided by plasma treatment to form oxide or nitride films 4621 a and4621 b (hereinafter also referred to as insulating films 4621 a and 4621b) on the surfaces of the semiconductor films 4603 a and 4603 brespectively (FIG. 32B). For example, when Si is used for thesemiconductor films 4603 a and 4603 b, silicon oxide (SiO_(x)) orsilicon nitride (SiN_(x)) is formed as the insulating films 4621 a and4621 b. Further, after being oxidized by plasma treatment, thesemiconductor films 4603 a and 4603 b may be subjected to plasmatreatment again to be nitrided. In this case, silicon oxide is formedover the semiconductor films 4603 a and 4603 b first, and then siliconnitride oxide (SiN_(x)O_(y)) (x>y) is formed over the surface of thesilicon oxide. Note that in the case of oxidizing the semiconductor filmby plasma treatment, the plasma treatment is performed in an oxygenatmosphere (for example, an atmosphere containing oxygen (O₂) and a raregas (containing at least one of He, Ne, Ar, Kr, and Xe), an atmospherecontaining oxygen, hydrogen (H₂), and a rare gas, or an atmospherecontaining dinitrogen monoxide and a rare gas). Meanwhile, in the caseof nitriding the semiconductor film by plasma treatment, the plasmatreatment is performed in a nitrogen atmosphere (for example, anatmosphere containing nitrogen (N₂) and a rare gas (containing at leastone of He, Ne, Ar, Kr, and Xe), an atmosphere containing nitrogen,hydrogen, and a rare gas, or an atmosphere containing NH₃ and a raregas). As the rare gas, Ar can be used, for example. Alternatively, amixed gas of Ar and Kr may be used. Therefore, the insulating films 4621a and 4621 b contain the rare gas (containing at least one of He, Ne,Ar, Kr, and Xe) used in the plasma treatment, and in the case where Aris used, the insulating films 4621 a and 4621 b contain Ar.

Since the plasma treatment is performed in the atmosphere containing theaforementioned gas, with the conditions of a plasma electron density of1×10¹¹ to 1×10¹³ cm⁻³, and a plasma electron temperature of 0.5 to 1.5eV. Since the plasma electron density is high and the electrontemperature on the periphery of a treatment subject (here, thesemiconductor films 4603 a and 4603 b) formed over the substrate 4601 islow, plasma damage to the treatment subject can be prevented. Inaddition, since the plasma electron density is as high as 1×10¹¹ cm⁻³ orhigher, an oxide or nitride film formed by oxidizing or nitriding thetreatment subject by plasma treatment is advantageous in evenness ofthickness or the like and dense as compared to a film formed by CVD,sputtering, or the like. Further, since the plasma electron temperatureis as low as 1 eV or less, oxidation or nitridation treatment can beperformed at a lower temperature, as compared to the conventional plasmatreatment or thermal oxidation. For example, oxidation or nitridationtreatment can be performed sufficiently even when plasma treatment isperformed at a temperature lower than the strain point of a glasssubstrate by 100 degrees or more. Note that as a frequency forgenerating plasma, high frequencies such as microwaves (2.45 GHz) can beused. Note that the plasma treatment is to be performed under theaforementioned conditions unless specified below.

Subsequently, the gate insulating film 4604 is formed so as to cover theinsulating films 4621 a and 4621 b (FIG. 32C). The gate insulating film4604 can be formed by sputtering, LPCVD, or plasma CVD to have either asingle-layer structure or a stacked-layer structure of an insulatingfilm containing oxygen or nitrogen, such as silicon oxide, siliconnitride, silicon oxynitride (SiO_(x)N_(y)) (x>y), or silicon nitrideoxide (SiN_(x)O_(y)) (x>y). For example, when Si is used for thesemiconductor films 4603 a and 4603 b, and Si is oxidized by plasmatreatment to form silicon oxide as the insulating films 4621 a and 4621b on the surfaces of the semiconductor films 4603 a and 4603 b, siliconoxide is formed as a gate insulating film over the insulating films 4621a and 4621 b. In addition, in FIG. 32B, when the insulating films 4621 aand 4621 b formed by oxidizing or nitriding the semiconductor films 4603a and 4603 b by plasma treatment are sufficiently thick, the insulatingfilms 4621 a and 4621 b can be used as the gate insulating films.

Subsequently, by forming the gate electrodes 4605 or the like over thegate insulating film 4604, a semiconductor device having the n-channeltransistor 4610 a and the p-channel transistor 4610 b which respectivelyhave the semiconductor films 4603 a and 4603 b with island shapes aschannel regions can be manufactured (FIG. 32D).

In this manner, by oxidizing or nitriding the surfaces of thesemiconductor films 4603 a and 4603 b by plasma treatment beforeproviding the gate insulating film 4604 over the semiconductor films4603 a and 4603 b, short circuits or the like between the gateelectrodes and the semiconductor films can be prevented, which would becaused by coverage defects of the gate insulating film 4604 at edgeportions 4651 a and 4651 b of the channel regions. That is, if the edgeportions of the island-shaped semiconductor films have an almost rightangle (0=85 to 100 degrees), there is a concern that when a gateinsulating film is formed so as to cover the semiconductor films by CVD,sputtering, or the like, a coverage defect might be caused, resultingfrom breaking of the gate insulating film at the edge portions of thesemiconductor films, or the like. However, such a coverage defect or thelike can be prevented by oxidizing or nitriding the surfaces of thesemiconductor films by plasma treatment in advance.

Alternatively, in FIG. 32C, the gate insulating film 4604 may beoxidized or nitrided by performing plasma treatment after forming thegate insulating film 4604. In this case, an oxide or nitride film(hereinafter also referred to as an insulating film 4623) is formed overthe surface of the gate insulating film 4604 (FIG. 33A) by oxidizing ornitriding the gate insulating film 4604 by performing plasma treatmentto the gate insulating film 4604 which is formed so as to cover thesemiconductor films 4603 a and 4603 b (FIG. 33B). The plasma treatmentcan be performed with similar conditions to those in FIG. 32B. Inaddition, the insulating film 4623 contains a rare gas which is used inthe plasma treatment, and for example contains Ar when Ar is used forthe plasma treatment.

Alternatively, referring to FIG. 33B, after oxidizing the gateinsulating film 4604 by performing plasma treatment in an oxygenatmosphere, the gate insulating film 4604 may be subjected to plasmatreatment again in a nitrogen atmosphere, so as to be nitrided. In thiscase, silicon oxide or silicon oxynitride (SiO_(x)N_(y)) (x>y) is formedso as to have shapes of the semiconductor films 4603 a and 4603 b first,and then silicon nitride oxide (SiN_(x)O_(y)) (x>y) is formed so as tobe in contact with the gate electrodes 4605. After that, by forming thegate electrodes 4605 or the like over the insulating film 4623, asemiconductor device having the n-channel transistor 4610 a and thep-channel transistor 4610 b which respectively have the semiconductorfilms 4603 a and 4603 b with island shapes as channel regions can bemanufactured (FIG. 33C). In this manner, by oxidizing or nitriding thesurface of the gate insulating film by plasma treatment, the surface ofthe gate insulating film can be modified to form a dense film. Theinsulating film obtained by plasma treatment is dense and has fewdefects such as pin holes, as compared to an insulating film formed byCVD or sputtering. Therefore, the characteristics of the transistors canbe improved.

Although FIGS. 33A to 33C show the case where the surfaces of thesemiconductor films 4603 a and 4603 b are oxidized or nitrided byperforming plasma treatment to the semiconductor films 4603 a and 4603 bin advance, such a method may be employed that plasma treatment is notperformed to the semiconductor films 4603 a and 4603 b, but performedafter forming the gate insulating film 4604. In this manner, byperforming plasma treatment before forming a gate electrode, asemiconductor film can be oxidized or nitrided even if the semiconductorfilm is exposed due to a coverage defect such as breaking of a gateinsulating film at edge portions of the semiconductor film; therefore,short circuits or the like between the gate electrode and thesemiconductor film can be prevented, which would be caused by a coveragedefect of the gate insulating film at the edge portions of thesemiconductor film.

In this manner, by oxidizing or nitriding the semiconductor films or thegate insulating film by plasma treatment, short circuits or the likebetween the gate electrodes and the semiconductor films can beprevented, which would be caused by a coverage defect of the gateinsulating film at the edge portions of the semiconductor films, even ifthe island-shaped semiconductor films are formed so as to have edgeportions with an almost right angle.

Subsequently, a case is shown where the island-shaped semiconductorfilms formed over the substrate are provided with tapered edge portions(θ=30 to 85°).

First, the semiconductor films 4603 a and 4603 b with island shapes areformed over the substrate 4601 (FIG. 34A). The semiconductor films 4603a and 4603 b with island shapes can be provided by forming an amorphoussemiconductor film over the insulating film 4602 which is formed overthe substrate 4601 in advance, by sputtering, LPCVD, plasma CVD, or thelike using a material containing silicon (Si) as a main component (forexample, Si_(x)Ge_(1-x)) or the like, and then crystallizing theamorphous semiconductor film by laser crystallization, thermalcrystallization using RTA or an annealing furnace, or thermalcrystallization using metal elements which promote crystallization, andfurther selectively etching the semiconductor film to be removed. Notethat in FIG. 34A, the island-shaped semiconductor films are formed so asto have tapered edge portions (θ=30 to 85°).

Subsequently, the gate insulating film 4604 is formed so as to cover thesemiconductor films 4603 a and 4603 b (FIG. 34B). The gate insulatingfilm 4604 can be provided so as to have either a single-layer structureor a stacked-layer structure of an insulating film containing oxygen ornitrogen, such as silicon oxide, silicon nitride, silicon oxynitride(SiO_(x)N_(y)) (x>y), or silicon nitride oxide (SiN_(x)O_(y)) (x>y) bysputtering, LPCVD, plasma CVD, or the like.

Subsequently, an oxide or nitride film (hereinafter also referred to asan insulating film 4624) is formed on the surface of the gate insulatingfilm 4604 by oxidizing or nitriding the gate insulating film 4604 byplasma treatment (FIG. 34C). The plasma treatment can be performed underthe aforementioned conditions. For example, in the case where siliconoxide or silicon oxynitride (SiO_(x)N_(y)) (x>y) is used as the gateinsulating film 4604, the gate insulating film 4604 is oxidized byperforming plasma treatment in an oxygen atmosphere, thereby a densefilm with few defects such as pin holes can be formed on the surface ofthe gate insulating film, as compared to a gate insulating film formedby CVD, sputtering, or the like. On the other hand, when the gateinsulating film 4604 is nitrided by plasma treatment in a nitrogenatmosphere, a silicon nitride oxide film (SiN_(x)O_(y)) (x>y) can beprovided as the insulating film 4624 on the surface of the gateinsulating film 4604. Alternatively, after oxidizing the gate insulatingfilm 4604 by performing plasma treatment in an oxygen atmosphere, thegate insulating film 4604 may be subjected to plasma treatment again ina nitrogen atmosphere, so as to be nitrided. In addition, the insulatingfilm 4624 contains a rare gas which is used in the plasma treatment, andcontains Ar when Ar is used in the plasma treatment, for example.

Subsequently, by forming the gate electrodes 4605 or the like over thegate insulating film 4604, a semiconductor device having the n-channeltransistor 4610 a and the p-channel transistor 4610 b which respectivelyhave the semiconductor films 4603 a and 4603 b with island shapes aschannel regions can be manufactured (FIG. 34D).

In this manner, by performing plasma treatment to the gate insulatingfilm, an insulating film made of an oxide or nitride film can beprovided on the surface of the gate insulating film, and thus thesurface of the gate insulating film can be modified. Since theinsulating film obtained by oxidation or nitridation with plasmatreatment is dense and has few defects such as pin holes, as compared toa gate insulating film formed by CVD or sputtering, the characteristicsof the transistors can be improved. In addition, short circuits or thelike between the gate electrodes and the semiconductor films can beprevented by forming the semiconductor films so as to have tapered edgeportions, which would be caused by a coverage defect of the gateinsulating film at the edge portions of the semiconductor films.Furthermore, short circuits or the like between the gate electrodes andthe semiconductor films can be prevented even more effectively byperforming plasma treatment after forming the gate insulating film.

Subsequently, description is made of a manufacturing method of asemiconductor device which differs from that in FIGS. 34A to 34D, withreference to the drawings. Specifically, a case is shown where plasmatreatment is selectively performed to tapered edge portions ofsemiconductor films.

First, the semiconductor films 4603 a and 4603 b with island shapes areformed over the substrate 4601 (FIG. 35A). The semiconductor films 4603a and 4603 b with island shapes can be provided by forming an amorphoussemiconductor film over the insulating film 4602 which is formed overthe substrate 4601 in advance, by sputtering, LPCVD, plasma CVD, or thelike using a material containing silicon (Si) as a main component (forexample, SixGe1-x) or the like, crystallizing the amorphoussemiconductor film, and further etching the semiconductor filmselectively by using resists 4625 a and 4625 b as masks. Note that thecrystallization of the amorphous semiconductor film can be performed bya crystallization method such as laser crystallization, thermalcrystallization using RTA or an annealing furnace, thermalcrystallization using metal elements which promote crystallization, or acombination of them.

Subsequently, the edge portions of the semiconductor films 4603 a and4603 b with island shapes are selectively oxidized or nitrided by plasmatreatment before removing the resists 4625 a and 4625 b which are usedfor etching the semiconductor films, thereby an oxide or nitride film(hereinafter also referred to as an insulating film 4626) is formed onedge portions of the semiconductor films 4603 a and 4603 b (FIG. 35B).The plasma treatment is performed under the aforementioned conditions.In addition, the insulating film 4626 contains a rare gas which is usedin the plasma treatment.

Subsequently, the gate insulating film 4604 is formed so as to cover thesemiconductor films 4603 a and 4603 b (FIG. 35C). The gate insulatingfilm 4604 can be formed in a similar manner to the aforementioned.

Subsequently, by forming the gate electrodes 4605 or the like over thegate insulating film 4604, a semiconductor device having the n-channeltransistor 4610 a and the p-channel transistor 4610 b which respectivelyhave the semiconductor films 4603 a and 4603 b with island shapes aschannel regions can be manufactured (FIG. 35D).

When the semiconductor films 4603 a and 4603 b are provided with taperededge portions, edge portions 4652 a and 4652 b of the channel regionswhich are formed in parts of the semiconductor films 4603 a and 4603 bare also tapered, thereby the thickness of the semiconductor films andthe gate insulating film in that portion differs from that in thecentral portion, which may adversely affect the characteristics of thetransistors. Thus, such effects on the transistors due to the edgeportions of the channel regions can be reduced by forming insulatingfilms over the semiconductor films, namely, the edge portions of thechannel regions, by selectively oxidizing or nitriding the edge portionsof the channel regions by plasma treatment here.

Although FIGS. 35A to 35D show an example where only the edge portionsof the semiconductor films 4603 a and 4603 b are oxidized or nitrided byplasma treatment, the gate insulating film 4604 can also be oxidized ornitrided by plasma treatment as shown in FIG. 34C (FIG. 37A).

Next, description is made of a manufacturing method of a semiconductordevice which differs from the aforementioned, with reference to thedrawings. Specifically, a case is shown where plasma treatment isperformed to semiconductor films with tapered shapes.

First, the semiconductor films 4603 a and 4603 b with island shapes areformed over the substrate 4601 similarly to the aforementioned (FIG.36A).

Next, the semiconductor films 4603 a and 4603 b are oxidized or nitridedby plasma treatment, thereby forming oxide or nitride films (hereinafteralso referred to as insulating films 4627 a and 4627 b) on the surfacesof the semiconductor films 4603 a and 4603 b (FIG. 36B). The plasmatreatment can be performed under the aforementioned conditions. Forexample, when Si is used for the semiconductor films 4603 a and 4603 b,silicon oxide or silicon nitride is formed as the insulating films 4627a and 4627 b. In addition, after being oxidized by plasma treatment, thesemiconductor films 4603 a and 4603 b may be subjected to plasmatreatment again to be nitrided. In this case, silicon oxide or siliconoxynitride (SiO_(x)N_(y)) (x>y) is formed on the semiconductor films4603 a and 4603 b first, and then silicon nitride oxide (SiN_(x)O_(y))(x>y) is formed on the silicon oxide. Therefore, the insulating films4627 a and 4627 b contain a rare gas which is used in the plasmatreatment. Note that the edge portions of the semiconductor films 4603 aand 4603 b are simultaneously oxidized or nitrided by performing plasmatreatment.

Next, the gate insulating film 4604 is formed so as to cover theinsulating films 4627 a and 4627 b (FIG. 36C). The gate insulating film4604 can be formed so as to have either a single-layer structure or astacked-layer structure of an insulating film containing oxygen ornitrogen, such as silicon oxide, silicon nitride, silicon oxynitride(SiO_(x)N_(y)) (x>y), or silicon nitride oxide (SiN_(x)O_(y)) (x>y) bysputtering, LPCVD, plasma CVD, or the like. For example, when Si is usedfor the semiconductor films 4603 a and 4603 b, and the surfaces of thesemiconductor films 4603 a and 4603 b are oxidized by plasma treatmentto form silicon oxide as the insulating films 4627 a and 4627 b, siliconoxide is formed as a gate insulating film over the insulating films 4627a and 4627 b.

Next, by forming the gate electrodes 4605 or the like over the gateinsulating film 4604, a semiconductor device having the n-channeltransistor 4610 a and the p-channel transistor 4610 b which respectivelyhave the semiconductor films 4603 a and 4603 b with island shapes aschannel regions can be manufactured (FIG. 36D).

When the semiconductor films are provided with tapered edge portions,edge portions of the channel regions which are formed in parts of thesemiconductor films are also tapered, which may adversely affect thecharacteristics of the semiconductor elements. Such effects on thesemiconductor elements can be reduced by oxidizing or nitriding thesemiconductor films by plasma treatment, since the edge portions of thechannel regions can also be oxidized or nitrided accordingly.

Although FIGS. 36A to 36D show examples where only the semiconductorfilms 4603 a and 4603 b are oxidized or nitrided by plasma treatment, itis needless to say that the gate insulating film 4604 may also beoxidized or nitrided by plasma treatment as shown in FIG. 34B (FIG.37B). In this case, after being oxidized by plasma treatment in anoxygen atmosphere, the gate insulating film 4604 may be subjected toplasma treatment again to be nitrided. In this case, silicon oxide(SiO_(x)) or silicon oxynitride (SiO_(x)N_(y)) (x>y) is formed so as tohave forms of the semiconductor films 4603 a and 4603 b first, and thensilicon nitride oxide (SiN_(x)O_(y)) (x>y) is formed so as to be incontact with the gate electrodes 4605.

At this time, dust 4673 is in a state of being easily removed from thesurface of the insulating film 4674 by simple washing such as brushing.In this manner, by performing plasma treatment, even fine dust which hasadhered to the insulating film or the semiconductor film can be easilyremoved. Note that this effect is obtained by performing plasmatreatment; therefore, the similar thing can be applied to not only thisembodiment, but other embodiments.

In this manner, by modifying the surface of a semiconductor film or agate insulating film by oxidization or nitridation using plasmatreatment, a dense and high-quality insulating film can be formed. Inaddition, dust or the like which has adhered to the surface of theinsulating film can be easily removed by washing. Accordingly, defectssuch as pin holes can be prevented even when the insulating film isformed thin, thereby microfabrication and high performance ofsemiconductor elements such as transistors can be realized.

Although this embodiment shows an example where plasma treatment isperformed to the semiconductor films 4603 a and 4603 b or the gateinsulating film 4604 to oxidize or nitride the semiconductor films 4603a and 4603 b or the gate insulating film 4604, a layer to be subjectedto the plasma treatment is not limited to these. For example, plasmatreatment may be performed to the substrate 4601 or the insulating film4602, or to the insulating film 4606 or 4607.

This embodiment may be implemented in free combination with Embodiment 1or 2.

Embodiment 4

In this embodiment, description is made of an example of a mask patternfor manufacturing a semiconductor device including transistors, forexample, with reference to FIGS. 41A to 43B.

Semiconductor layers 5610 and 5611 shown in FIG. 41A are preferablyformed of silicon or a crystalline semiconductor containing silicon. Forexample, single crystal silicon, polycrystal silicon obtained bycrystallizing a silicon film by laser annealing, or the like can beemployed. Alternatively, a metal oxide semiconductor, amorphous silicon,or an organic semiconductor can be employed as long as it exhibitssemiconductor characteristics.

In any case, a semiconductor to be formed first is provided over anentire or a part of surface of a substrate having an insulating surface(region having a larger area than the area which is defined as asemiconductor region of a transistor). Then, a mask pattern is formedover the semiconductor layer by photolithography. By etching thesemiconductor layer using the mask pattern, the semiconductor layers5610 and 5611 each having a specific island shape are formed, whichinclude source and drain regions and a channel forming region of atransistor. The semiconductor layers 5610 and 5611 are determined inaccordance with the adequacy of the layout.

The photomask for forming the semiconductor layers 5610 and 5611 shownin FIG. 41A is provided with a mask pattern 5630 shown in FIG. 41B. Theshape of this mask pattern 5630 differs depending on whether the resistused for the photolithography process is a positive type or a negativetype. In the case of using a positive resist, the mask pattern 5630shown in FIG. 41B is formed as a light shielding portion. The maskpattern 5630 has such a shape that a vertex A of a polygon is removed.In addition, a corner B has such a shape that a plurality of corners areprovided so as not to form a right-angled corner. In the pattern of thisphotomask, corners are removed so that one side of each removed corner(right-angled triangle) has a length of 10 μm or less, for example.

The semiconductor layers 5610 and 5611 shown in FIG. 41A reflect themask pattern 5630 shown in FIG. 41B. In this case, the mask pattern 5630may be transferred in such a manner that a pattern similar to theoriginal one is formed or corners of the mask pattern 5630 are morerounded. That is, roundish corner portions with a smoother shape may beprovided, as compared to those of the mask pattern 5630.

An insulating layer which at least partially contains silicon oxide orsilicon nitride is formed over the semiconductor layers 5610 and 5611.One purpose of forming this insulating layer is to form a gateinsulating layer. Then, gate wires 5712, 5713, and 5714 are formed so asto partially overlap the semiconductor layers as shown in FIG. 42A. Thegate wire 5712 is formed corresponding to the semiconductor layer 5610.The gate wire 5713 is formed corresponding to the semiconductor layers5610 and 5611. The gate wire 5714 is formed corresponding to thesemiconductor layers 5610 and 5611. The gate wires are formed bydepositing a metal layer or a highly conductive semiconductor layer overthe insulating layer and then printing a pattern onto the layer byphotolithography.

The photomask for forming the gate wires is provided with a mask pattern5731 shown in FIG. 42B. In this mask pattern 5731, its corners areremoved in such a manner that each removed corner (right-angledtriangle) has one side of 10 μm or less, or has one side of ⅕ to ½ ofthe wire width. The gate wires 5712, 5713, and 5714 shown in FIG. 42Areflect the shape of the mask pattern 5731 shown in FIG. 42B. In thiscase, although the mask pattern 5731 may be transferred in such a mannerthat a pattern similar to the mask pattern 5731 is formed or corners ofthe mask pattern 5731 are further rounded. That is, roundish cornerportions with a smoother shape may be provided, as compared to those ofthe mask pattern 5731. Specifically, each corner of the gate wires 5712,5713, and 5714 is formed so as to be roundish by removing an edgeportion so that the removed corner has a length of ⅕ to ½ of the wirewidth. Forming a projecting portion of a corner so as to be roundishhelps to suppress generation of fine powder due to abnormal discharge indry etching with plasma. In addition, by forming a depressed portion ofa corner to be roundish, such an effect can be obtained that, even whenfine powder are generated in washing, they can be washed away withoutgathering in the corner. As a result, yields can be expected to besignificantly improved.

An interlayer insulating layer is a layer to be formed after the gatewires 5712, 5713, and 5714 are formed. The interlayer insulating layeris formed using an inorganic insulating material such as silicon oxideor an organic insulating material such as polyimide or an acrylic resin.Another insulating layer such as silicon nitride or silicon nitrideoxide may be provided between the interlayer insulating layer and thegate wires 5712, 5713, and 5714. Further, an insulating layer such assilicon nitride or silicon nitride oxide may be provided over theinterlayer insulating layer as well. Such an insulating layer canprevent contamination of the semiconductor layer and the gate insulatinglayer with impurities which would adversely affect the transistor, suchas extrinsic metal ions or moisture.

Openings are formed in predetermined positions of the interlayerinsulating layer. For example, the openings are provided incorresponding positions to the gate wires and the semiconductor layerslocated below the interlayer insulating layer. A wiring layer which hasa single layer or a plurality of layers of metals or metal compounds isformed by photolithography with the use of a mask pattern, and thenetched into a predetermined pattern. Then, as shown in FIG. 43A, thewires 5815 to 5820 are formed so as to partially overlap thesemiconductor layers. A wire connects between specific elements, whichmeans that a wire connects specific elements not linearly but includescorners due to the restriction of a layout. In addition, the width ofthe wire varies in a contact portion and other portions. In the casewhere the width of a contact hole is equal to or wider than the wirewidth, the wire in the contact portion is formed wider than the width ofthe other portions.

A photomask for forming the wires 5815 to 5820 has a mask pattern 5832shown in FIG. 43B. In this case also, each wire is formed so as to havesuch a pattern that a right-angled corner (right-angled triangle) isremoved with the condition that one side of the removed triangle is 10μm or less, or has a length of ⅕ to ½ of the wire width, so that thecorner is rounded. Forming a projecting portion of a corner to beroundish helps to suppress generation of fine powder due to abnormaldischarge can be suppressed in dry etching with plasma. In addition, byforming a depressed portion of a corner to be roundish, such an effectcan be obtained that, even when fine powder are generated in washing,they can be washed away without gathering in the corner. Thus, yieldscan be significantly improved. When corners of wires are formed to beroundish, electrical conduction can be expected. Further, when aplurality of wires are formed in parallel, dust can be easily washedaway.

In FIG. 43A, n-channel transistors 5821 to 5824 and p-channeltransistors 5825 and 5826 are formed. The n-channel transistor 5823 andthe p-channel transistor 5825, and the n-channel transistor 5824 and thep-channel transistor 5826 constitute inverters 5827 and 5828respectively. Note that a circuit including the six transistorsconstitutes an SRAM. An insulating layer such as silicon nitride orsilicon oxide may be formed over these transistors.

Note that this embodiment can be implemented in free combination withany of Embodiments 1 to 3.

Embodiment 5

In this embodiment, description is made of a structure where a substrateon which pixels are formed is sealed, with reference to FIGS. 25A to25C. FIG. 25A is a top plan view of a panel where a substrate on whichpixels are formed is scaled, and FIGS. 25B and 25C are cross sectionalviews taken along a line A-A′ of FIG. 25A. FIGS. 25B and 25C showexamples where sealing is performed by different methods.

In FIGS. 25A to 25C, a pixel portion 2502 having a plurality of pixelsis provided over a substrate 2501, and a sealant 2506 is provided so asto surround the pixel portion 2502, while a sealing material 2507 isattached thereto. For the structure of pixels, those described inembodiment modes or Embodiment 1 can be employed.

In the display panel in FIG. 25B, the sealing material 2507 in FIG. 25Acorresponds to a counter substrate 2521. The counter substrate 2521which transmits light is attached to the substrate 2501 using thesealant 2506 as an adhesive layer, and accordingly, a scaled space 2522is formed by the substrate 2501, the counter substrate 2521, and thesealant 2506. The counter substrate 2521 is provided with a color filter2520 and a protective film 2523 for protecting the color filter. Lightemitted from light emitting elements which are disposed in the pixelportion 2502 is emitted outside through the color filter 2520. Thesealed space 2522 is filled with an inert resin, liquid, or the like.Note that the resin for filling the sealed space 2522 may be alight-transmissive resin in which a moisture absorbent is dispersed. Inaddition, the same materials may be used for the sealant 2506 and amaterial filled in the sealed space 2522, so that the adhesion of thecounter substrate 2521 and the sealing of the pixel portion 2502 may beperformed simultaneously.

In the display panel shown in FIG. 25C, the sealing material 2507 inFIG. 25A corresponds to a sealing material 2524. The sealing material2524 is attached to the substrate 2501 using the sealant 2506 as anadhesive layer, and a sealed space 2508 is formed by the substrate 2501,the sealant 2506, and the sealing material 2524. The sealing material2524 is provided with a moisture absorbent 2509 in advance in itsdepressed portion, and the moisture absorbent 2509 functions to keep aclean atmosphere in the scaled space 2508 by adsorbing moisture, oxygen,and the like, and to suppress degradation of the light emittingelements. The depressed portion is covered with a fine-meshed covermaterial 2510. The cover material 2510 transmits air and moisture,whereas the moisture absorbent 2509 does not transmit them. Note thatthe sealed space 2508 may be filled with a rare gas such as nitrogen orargon, as well as an inert resin or liquid.

An input terminal portion 2511 for transmitting signals to the pixelportion 2502 and the like are provided over the substrate 2501. Signalssuch as video signals are transmitted to the input terminal portion 2511through an FPC (Flexible Printed Circuit) 2512. At the input terminalportion 2511, wires formed over the substrate 2501 are electricallyconnected to wires provided in the FPC 2512 with the use of a resin inwhich conductors are dispersed (anisotropic conductive resin: ACF).

The pixel portion 2502 and a driver circuit for inputting signals to thepixel portion 2502 may be integrally formed over the substrate 2501.Alternatively, the driver circuit for inputting signals to the pixelportion 2502 may be formed into an IC chip so as to be connected ontothe substrate 2501 by COG (Chip On Glass), or the IC chip may bedisposed over the substrate 2501 by using TAB (Tape Automated Bonding)or a printed board.

This embodiment can be implemented in free combination with any ofEmbodiments 1 to 4.

Embodiment 6

The invention can be applied to a display module where a circuit forinputting signals to a panel is mounted on the panel.

FIG. 26 shows a display module where a panel 2600 is combined with acircuit board 2604. Although FIG. 26 shows an example where a controller2605, a signal dividing circuit 2606, and the like are formed over thecircuit board 2604, circuits formed over the circuit board 2604 are notlimited to these. Any circuit which can generate signals for controllingthe panel may be formed.

Signals outputted from the circuits formed over the circuit board 2604are inputted to the panel 2600 through a connecting wire 2607.

The panel 2600 includes a pixel portion 2601, a source driver 2602, andgate drivers 2603. The structure of the panel 2600 may be similar tothose described in Embodiments 1, 2, and the like. Although FIG. 26shows an example where the source driver 2602 and the gate drivers 2603are formed over the same substrate as the pixel portion 2601, thedisplay module of the invention is not limited to this. Only the gatedrivers 2603 may be formed over the same substrate as the pixel portion2601, while the source driver 2602 is formed over a circuit board.Alternatively, both of the source driver and the gate drivers may beformed over a circuit board.

Display portions of various electronic appliances can be formed byincorporating such a display module.

This embodiment can be implemented in free combination with any ofEmbodiments 1 to 5.

Embodiment 7

In this embodiment, description is made of electronic appliancesaccording to the invention. The electronic appliances include a camera(a video camera, a digital camera, and the like), a projector, ahead-mounted display (goggle-type display), a navigation system, a carstereo, a personal computer, a game machine, a portable informationterminal (a mobile computer, a portable phone, an electronic book, andthe like), an image reproducing device provided with a recording medium(specifically, a device for reproducing a recording medium such as adigital versatile disc (DVD), and having a display that can display thereproduced image), and the like. Examples of the electronic appliancesare shown in FIGS. 27A to 27D.

FIG. 27A shows a personal computer which includes a main body 2711, ahousing 2712, a display portion 2713, a keyboard 2714, an externalconnecting port 2715, a pointing mouse 2716, and the like. The inventionis applied to the display portion 2713. With the invention, powerconsumption of the display portion can be reduced.

FIG. 27B shows an image reproducing device provided with a recordingmedium (specifically, a DVD reproducing device), which includes a mainbody 2721, a housing 2722, a first display portion 2723, a seconddisplay portion 2724, a recording medium (DVD or the like) readingportion 2725, an operating key 2726, a speaker portion 2727, and thelike. The first display portion 2723 mainly displays image data, whilethe second display portion 2724 mainly displays text data. The inventionis applied to the first display portion 2723 and the second displayportion 2724. With the invention, power consumption of the displayportion can be reduced.

FIG. 27C shows a portable phone which includes a main body 2731, anaudio output portion 2732, an audio input portion 2733, a displayportion 2734, operating switches 2735, an antenna 2736, and the like.The invention is applied to the display portion 2734. With theinvention, power consumption of the display portion can be reduced.

FIG. 27D shows a camera which includes a main body 2741, a displayportion 2742, a housing 2743, an external connecting port 2744, a remotecontrol receiving portion 2745, an image receiving portion 2746, abattery 2747, an audio input portion 2748, operating keys 2749, and thelike. The invention is applied to the display portion 2742. With theinvention, power consumption of the display portion can be reduced.

This embodiment can be implemented in free combination with any ofEmbodiments 1 to 6.

This application is based on Japanese Patent Application serial no.2005-303771 filed in Japan Patent Office on 18 Oct. 2005, the entirecontents of which are hereby incorporated by reference.

1. (canceled)
 2. A semiconductor device comprising: a first transistor;a second transistor; a third transistor; and a fourth transistor,wherein one of a source and a drain of the first transistor, one of asource and a drain of the second transistor, and an output terminal areelectrically connected to one another, wherein a gate of the firsttransistor, one of a source and a drain of the third transistor, one ofa source and a drain of the fourth transistor are electrically connectedto one another, wherein a gate of the second transistor and a gate ofthe third transistor are electrically connected to one another, whereina gate signal line is electrically connected to the output terminal,wherein a power source line is electrically connected to the other ofthe source and the drain of the second transistor, and the other of thesource and the drain of the third transistor, wherein a clock signalline is electrically connected to the other of the source and the drainof the first transistor, and wherein the power source line is locatedbetween the clock signal line and the output terminal, and the clocksignal line is not located between the power source line and the outputterminal.
 3. A semiconductor device comprising: a stage comprising: afirst transistor; a second transistor; a third transistor; a fourthtransistor; a fifth transistor; and a capacitor, wherein one of a sourceand a drain of the first transistor, one of a source and a drain of thesecond transistor, one of a source and a drain of the fifth transistor,a first electrode of the capacitor, and an output terminal of the stageare electrically connected to one another, wherein a gate of the firsttransistor, one of a source and a drain of the third transistor, one ofa source and a drain of the fourth transistor, and a second electrode ofthe capacitor are electrically connected to one another, wherein a gateof the fourth transistor, the other of the source and the drain of thefourth transistor, and an output terminal of a preceding stage areelectrically connected to one another, wherein a gate of the secondtransistor and a gate of the third transistor are electrically connectedto one another, wherein a gate signal line is electrically connected tothe output terminal of the stage, wherein a power source line iselectrically connected to the other of the source and the drain of thesecond transistor, the other of the source and the drain of the thirdtransistor, and the other of the source and the drain of the fifthtransistor, wherein a first clock signal line is electrically connectedto the other of the source and the drain of the first transistor,wherein a second clock signal line is electrically connected to a gateof the fifth transistor, and wherein the power source line is locatedbetween the first to second clock signal lines and the output terminalof the stage, and each of the first to second clock signal lines is notlocated between the power source line and the output terminal of thestage.
 4. A semiconductor device comprising: a first transistor; asecond transistor; a third transistor; and a fourth transistor, whereinone of a source and a drain of the first transistor, one of a source anda drain of the second transistor, and an output terminal areelectrically connected to one another, wherein a gate of the firsttransistor, one of a source and a drain of the third transistor, one ofa source and a drain of the fourth transistor are electrically connectedto one another, wherein a gate of the second transistor and a gate ofthe third transistor are electrically connected to one another, whereina conductive layer comprises the gate of the second transistor and thegate of the third transistor, wherein a gate signal line is electricallyconnected to the output terminal, wherein a power source line iselectrically connected to the other of the source and the drain of thesecond transistor, and the other of the source and the drain of thethird transistor, wherein a clock signal line is electrically connectedto the other of the source and the drain of the first transistor, andwherein the power source line is located between the clock signal lineand the output terminal, and the clock signal line is not locatedbetween the power source line and the output terminal.
 5. Asemiconductor device comprising: a stage comprising: a first transistor;a second transistor; a third transistor; a fourth transistor; a fifthtransistor; and a capacitor, wherein one of a source and a drain of thefirst transistor, one of a source and a drain of the second transistor,one of a source and a drain of the fifth transistor, a first electrodeof the capacitor, and an output terminal of the stage are electricallyconnected to one another, wherein a gate of the first transistor, one ofa source and a drain of the third transistor, one of a source and adrain of the fourth transistor, and a second electrode of the capacitorare electrically connected to one another, wherein a gate of the fourthtransistor, the other of the source and the drain of the fourthtransistor, and an output terminal of a preceding stage are electricallyconnected to one another, wherein a gate of the second transistor and agate of the third transistor are electrically connected to one another,wherein a conductive layer comprises the gate of the second transistorand the gate of the third transistor, wherein a gate signal line iselectrically connected to the output terminal of the stage, wherein apower source line is electrically connected to the other of the sourceand the drain of the second transistor, the other of the source and thedrain of the third transistor, and the other of the source and the drainof the fifth transistor, wherein a first clock signal line iselectrically connected to the other of the source and the drain of thefirst transistor, wherein a second clock signal line is electricallyconnected to a gate of the fifth transistor, and wherein the powersource line is located between the first to second clock signal linesand the output terminal of the stage, and each of the first to secondclock signal lines is not located between the power source line and theoutput terminal of the stage.